Bonding– tag –
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GlobalFoundries Secures $300M U.S. Department of Commerce Award to Accelerate Silicon Photonics R&D, Bolstering U.S. Leadership
GlobalFoundries USA Overview GlobalFoundries has signed a Letter of Intent with the U.S. Department of Commerce for a $300 million award from the CHIPS R&D Office. This funding aims to accelerate next-generation silicon photonics R&a... -
NCF Evolves into Essential Material for AI Chips, HBM Stacking, and Advanced Packaging, Ensuring Stable Bonding and Enhanced Reliability
LP Information Data Global Overview Non-Conductive Film (NCF) has evolved from an auxiliary adhesive to an indispensable material in advanced packaging, driven by rapid advancements in AI servers, accelerated computing chips, High-Bandwi... -
BESI Records All-Time High Orders with 128.8% Y-o-Y Growth Driven by AI Packaging and Hybrid Bonding Demand
BE Semiconductor Industries N.V. Netherlands Overview BE Semiconductor Industries (BESI), a Dutch equipment manufacturer, reported a record €292.9 million in orders for Q2 2026, marking a 128.8% year-on-year increase, fueled by strong de... -
HBM4 Competition Shifts to Cooling Technology Amid Hybrid Bonding Delays and Nvidia’s Next-Gen GPU Trends
DigiTimes Taiwan Overview Industry experts note that the focus of competition in the 6th-generation High-Bandwidth Memory (HBM4) market is shifting towards cooling technology, against the backdrop of delays in hybrid bonding adoption. HB... -
Indian State of Madhya Pradesh Signs MoU for ₹6,200 Crore OSAT Facility with Paras Semiconductors, Advancing Heterogeneous Integration and 3D Packaging
ET Government India Overview The government of Madhya Pradesh, India, announced a Memorandum of Understanding with Paras Semiconductors to establish an advanced semiconductor packaging OSAT (Outsourced Semiconductor Assembly and Test) fa... -
Samsung Delays Hybrid Bonding HBM Mass Production to 2029-2030, Aligning with Technical Challenges and NVIDIA’s Next-Gen GPUs
TrendForce South Korea Overview Samsung Electronics is reportedly delaying the full-scale mass production of its hybrid bonding technology for next-generation HBM and logic semiconductors until 2029-2030. The company is currently buildin... -
Besi Semiconductor Reports Doubled Quarterly Orders Driven by Soaring AI and Hybrid Bonding Demand, Expanding Customer Base
WHTC (Reuters) Netherlands Overview BE Semiconductor Industries (Besi) announced a more than twofold increase in quarterly orders year-over-year, driven by robust demand from AI, hybrid bonding, photonics, and data centers. The company's... -
TSMC Unveils Next-Gen ‘COUPE’ Silicon Photonics Platform for AI Optical Interconnect, Targeting 1.6 Tb/s Optical Engines by 2026
Tech Investments Taiwan Overview TSMC has announced 'COUPE,' a silicon photonics platform for co-packaged optics (CPO) in the AI era. COUPE innovatively stacks two dies—a photonic IC and an electronic IC—using SoIC bonding, placing the o... -
Samsung Electronics Advances “2.xD” Packaging Integrating HBM, Logic, and Optical Tech to Resolve AI Power and Heat Bottlenecks
BigGo Finance South Korea Overview Samsung Electronics is developing "2.xD" next-generation packaging technology that integrates High Bandwidth Memory (HBM), logic chips, and silicon photonics (SiPh) into a single package to address crit... -
Rapidus to Establish 2nm AI Chip Mass Production by 2027, Bolstering Japan’s Semiconductor Ecosystem
DataM Intelligence International Overview Japan's Rapidus, backed by government and private funding, aims to establish domestic 2nm advanced semiconductor manufacturing and mass produce AI chips by 2027. This initiative will stimulate de...
