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ECTC 2026 Highlights Advanced Packaging Future: Glass Substrates and FOPLP at the Core of System Innovation
Advanced Packaging Magazine USA Overview ECTC 2026 emphasized a structural shift in semiconductor innovation, moving beyond transistor scaling to packaging and integration technologies. Noteworthy advancements in heterogeneous integratio... -
TSMC CoWoS & SoIC Packaging Become Primary AI Chip Bottleneck, Forecasting 10-20% Global Supply Shortfall by 2027 Amidst Doubling Demand
Exponential Industry Taiwan Overview TSMC's CoWoS and SoIC packaging technologies are identified as the primary physical constraints in AI GPU and accelerator production. Global CoWoS demand is projected to double from 1.3-1.4 million wa... -
JEDEC Relaxes HBM4 Package Height to 775 µm, Enabling 12-Hi/16-Hi Stacks Without Immediate Cu-Cu Hybrid Bonding
Exponential Industry USA Overview JEDEC has relaxed the HBM4 package height specification from 720 µm to 775 µm, allowing for 12-Hi and 16-Hi stack HBM modules without immediate reliance on Cu-Cu hybrid bonding. HBM utilizes 3D stacked D... -
KLA Forecasts $1.1 Billion in Advanced Packaging Revenue for 2026, Driven by Surging AI and HBM Demand
Quartz USA Overview KLA Corporation anticipates its advanced packaging business revenue will reach approximately $1.1 billion in 2026, representing over 70% year-over-year growth, fueled by increasing AI infrastructure investments and se... -
TSMC Achieves Over 98% CoWoS Yield; ABF Substrates Emerge as Next Bottleneck for AI Chip Expansion
Xenospectrum Taiwan Overview TSMC has announced that its advanced CoWoS packaging technology, particularly for 5.5x reticle AI chip products, consistently achieves yields exceeding 98%. While CoWoS capacity has doubled annually for three... -
Shanghai Jiao Tong University Simplifies Photonic-Electronic Integration with Reconfigurable Germanium-Silicon Photodetectors Using FOWLP
Technology News | Advanced Photonics Nexus (SPIE) China Overview Researchers at Shanghai Jiao Tong University have developed reconfigurable germanium-silicon photodetectors utilizing a low-loss integration strategy based on Fan-Out Wafer... -
IMAPS Device Packaging Conference 2026 PDCs Focus on Advanced Packaging for Chiplets and Heterogeneous Integration, Highlighting Hybrid Bonding
IMAPS USA Overview IMAPS Device Packaging Conference 2026 Professional Development Courses (PDCs) extensively covered "Advanced Packaging for Chiplets and Heterogeneous Integration." The courses defined various 2D to 3.5D IC integrations... -
ECTC2026 Unveils Future of Semiconductor Packaging: Precision Adhesives and Low-Temperature Hybrid Bonding for HBM Integration
Tech I Japan Overview ECTC2026 highlighted critical R&D in advanced semiconductor packaging, showcasing innovations in chiplet integration, hybrid bonding, and opto-electronic convergence. Key presentations included Mitsui Chemicals ... -
ASMPT’s Advanced Packaging Business Achieves Record Sales in H1 2026, Driven by Surging AI Demand
ASMPT Singapore Overview ASMPT reported robust financial results for the first half of 2026, with its Advanced Packaging (AP) business achieving record sales, significantly propelled by escalating AI demand. Key contributors included The... -
Besi Achieves Record €292.9M Orders in Q2 2026, Driven by AI Demand and 128.8% Growth in Hybrid Bonding Technology
ET Electronics News Netherlands Overview BE Semiconductor Industries (Besi) reported record Q2 2026 orders of €292.9 million, a 128.8% increase year-over-year, primarily fueled by robust AI-related demand and the surging adoption of its ...
