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BESI Hybrid Bonding System Orders Exceed 150 Units, HBM5 Onward to Accelerate Memory Adoption
PhotonCap Unknown Overview BESI has secured over 150 cumulative orders for its hybrid bonding systems, with six integrated production lines (including 30 BESI bonders) implemented by major logic customers in partnership with Applied Mate... -
Samsung’s zHBM Concept Promises 70% Lower I/O Power, 2.3x Bandwidth vs. HBM5 via Hybrid Bonding for Edge AI
Tom's Hardware South Korea Overview Samsung proposes zHBM, an innovative memory architecture that directly stacks DRAM onto the processor, bypassing the interposer, and is projected to reduce I/O power by approximately 70% compared to HB... -
EV Group Solves Co-packaged Optics Manufacturing Challenges with Wafer Bonding and Nanoimprint for High-Density Integration
Quality Digest USA Overview EV Group (EVG) is addressing critical manufacturing challenges for Co-packaged Optics (CPO), which integrates Photonic Integrated Circuits (PICs), lasers, and optical structures within a single package. EVG's ... -
Laser Debonding Technology Becomes Critical for Improving Thin Wafer Yield in HBM and Hybrid Bonding
Microtreat Global Overview Laser debonding is gaining importance as the cleanest and least damaging wafer separation technology for high-value 3D integration and advanced packaging. For ultra-thin wafers (20-50 micrometers) in HBM, chipl... -
Applied Materials Forecasts Over 70% Growth in Advanced Packaging Revenue, Total Revenue Up 40%, Driven by AI and HBM Demand
TradingKey USA Overview Applied Materials projects approximately 40% growth in its total revenue for 2026, benefiting significantly from the increasing complexity in AI chip and HBM manufacturing. The company anticipates over 70% growth ... -
KLA Achieves $1.1 Billion in Advanced Packaging Process Control Revenue, Driven by Surging AI Chip Demand
Quartz USA Overview KLA projects approximately $1.1 billion in revenue from its advanced packaging process control systems in 2026, marking over 70% year-over-year growth, driven by the increasing complexity of AI and HPC chips. The shif... -
Hybrid Bonding Equipment Market Projected to Reach $1.73 Billion in 2026, Growing to $2.58 Billion by 2032
360iResearch Global Overview This article provides an overview of a market research report published by 360iResearch. The hybrid bonding equipment market is projected to reach $1.73 billion in 2026, with a compound annual growth rate (CA... -
API Unveils GEMINI PRO, NUERA PRO, and AP-M3500 Bonding Platforms for Next-Gen Semiconductors at SEMICON Taiwan 2026, Addressing Key Packaging Bottlenecks
API (Advanced Packaging Intelligence) Unknown Overview API (Advanced Packaging Intelligence) reported a successful exhibition of next-generation advanced packaging technologies at SEMICON Taiwan 2026. Their GEMINI PRO, NUERA PRO, and AP-... -
Amkor Technology and NVIDIA Announce $1.5 Billion Advanced Packaging Partnership to Accelerate AI Multi-Die Integration
IMAPS 3D InCites Content Platform USA Overview Amkor Technology and NVIDIA announced a multi-year partnership in July 2026, including a $1.5 billion advanced packaging and development agreement, to drive next-generation technology for AI... -
KLA’s Advanced Packaging Business Set for $1.1 Billion Revenue, 70%+ Growth Driven by AI Demand and Yield Bottleneck Resolution
Quartz USA Overview KLA is significantly benefiting from accelerating demand for advanced packaging inspection, metrology, and process control tools due to the increasing complexity of AI/HPC chips and hybrid bonding advancements. Its ad...
