CMP– tag –
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Applied Materials Forecasts Over 70% Growth in Advanced Packaging Revenue, Total Revenue Up 40%, Driven by AI and HBM Demand
TradingKey USA Overview Applied Materials projects approximately 40% growth in its total revenue for 2026, benefiting significantly from the increasing complexity in AI chip and HBM manufacturing. The company anticipates over 70% growth ... -
Applied Materials Launches New HBM & 3D Packaging Systems, Acquires ASMPT NEXX to Scale AI Compute
Exoswan Insights USA Overview Applied Materials has introduced new CMP, ECD, deposition, and e-beam systems for HBM and 3D packaging, alongside acquiring ASMPT's NEXX business, to capitalize on the escalating demand for AI computing. The... -
Applied Materials Raises Advanced Packaging Revenue Forecast to Over 70% Growth on AI Demand, Unveils New HBM Systems
TrendForce USA Overview Applied Materials has significantly revised its advanced packaging revenue forecast for 2026 to over 70% year-over-year growth, a 20-percentage-point increase in just three months, driven by soaring AI semiconduct... -
Applied Materials Unleashes Six New Systems to Turbocharge AI Chips with Advanced Packaging and Sub-10nm Defect Detection
Applied Materials USA Overview Applied Materials has launched six innovative systems to significantly accelerate the development and manufacturing of DRAM and advanced packaging for next-generation AI chips. These solutions tackle critic... -
Applied Materials Unveils New Systems for DRAM and Advanced Packaging to Accelerate AI Chip Manufacturing, Featuring Epitaxy, CMP, and E-beam Inspection Technologies
Barchart.com USA Overview Applied Materials has introduced a suite of new chipmaking systems designed to accelerate the construction of advanced 3D chip architectures powering next-generation AI. This includes epitaxy systems optimizing ... -
Applied Materials Unveils New Systems to Accelerate DRAM and Advanced Packaging for AI Chips
Applied Materials, Inc. USA Overview Applied Materials has introduced a suite of new material engineering systems designed to accelerate the manufacturing of advanced 3D chip architectures crucial for next-generation AI. These innovation...
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