CTE– tag –
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Micro-CT Emerges as Key Non-Destructive 3D Analysis Approach for Semiconductor Package Warpage, Addressing Critical Reliability Challenges
AZoM UK Overview Semiconductor package warpage is a critical issue significantly compromising package performance and reliability. This deformation stems from Coefficient of Thermal Expansion mismatches among package materials (substrate... -
Amkor Technology Presents Large Package Performance Evaluation of Glass Core Substrates for AI and HPC Applications at ECTC 2026
Amkor Technology South Korea Overview Amkor Technology's JongMin Park presented a technical poster on "Large Package Performance Evaluation of Glass Core Substrates for AI and HPC Applications" at ECTC 2026, a leading forum in electronic... -
Novel Low-CTE Epoxy Molding Compound Developed to Tackle Warpage in Large AI Semiconductors
Journal of Materials Science & Technology Global Overview Researchers have developed a novel low-coefficient of thermal expansion (CTE) epoxy molding compound specifically for encapsulating large dies such as HBM and AI semiconductors. T... -
Hoenle Adhesives Launches High-Reliability Underfill ‘Structalit® 8205’ for Miniaturized, High-Density Electronic Assemblies
Adhesives & Sealants Industry (ASI) Germany Overview Hoenle Adhesives has introduced Structalit® 8205, an underfill designed for modern, miniaturized, and high-density electronic assemblies, offering exceptional mechanical stability, the... -
Resonac Successfully Upholds Patent on Liquid Encapsulant for AI Semiconductor Packages, Enhancing 2.5D Package Reliability
Resonac Corporation Japan Overview Resonac Corporation announced the Japan Patent Office upheld its patent (No. 7687499) on a liquid encapsulant for 2.5D semiconductor packages in AI applications. This encapsulant is critical for address... -
Glass Core Substrates Emerge as Next-Gen AI/HPC Packaging Technology, Face Commercialization Hurdles in Brittleness and TGV Formation
Pandaily China Overview Glass core substrates are garnering significant attention in the semiconductor packaging industry, driven by escalating performance demands in AI chips, HPC, and advanced processor packaging. They offer superior d... -
Mastering 3D-IC Verification Complexity: Multiphysics Analysis Key to Addressing Thermal, Mechanical Stress, and Reliability Challenges
Semiconductor Engineering USA Overview As the semiconductor industry transitions from 2D to 2.5D and 3D-IC configurations, verification complexity is escalating significantly. This article emphasizes the necessity of multiphysics analysi... -
Sumitomo Bakelite Develops G785 Series High-Tg Epoxy Molding Compounds with Industry-Leading 230°C Tg for Next-Gen SiC Power Modules
Sumitomo Bakelite Co., Ltd. Japan Overview Sumitomo Bakelite has developed the 'G785 Series' of high-Tg epoxy molding compounds for next-generation SiC power modules, achieving an industry-leading glass transition temperature (Tg) of 230... -
Alliance Chemical Report: Advanced Talc Applications Crucial for EV Battery Thermal Management and Power Electronics Reliability
Alliance Chemical USA Overview An Alliance Chemical report highlights that engineered talc grades are becoming critical in high-tech manufacturing, including EV battery thermal management and power electronics. In epoxy molding compounds... -
Ceramic Substrates Outperform PCB Materials in Thermal Performance for High-Power, High-Frequency Electronics
PatSnap Eureka Germany Overview The demand for materials with superior thermal performance and low dielectric loss is escalating in high-power, high-frequency electronic systems, where ceramic substrates demonstrate significant advantage...
