CTE– tag –
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Samsung Patents Wearable Electronic Device with Polarizing Structure Featuring Sub-10×10^-6/°C Thermal Expansion Layer
Samsung South Korea Overview Samsung has filed a patent for a wearable electronic device incorporating a polarizing structure, notably featuring a layer with a thermal expansion coefficient (CTE) below 10×10^-6/°C. This extremely low CTE... -
Semiconductor Equipment & Materials Market for HBM, Chiplets, and Low-CTE Materials Forecasted to Outpace Overall Wafer Equipment Growth
Mobility Foresights India Overview A Mobility Foresights report projects that the semiconductor equipment and materials market supporting sub-3nm logic, HBM, and chiplet integration will grow faster than the overall wafer equipment marke... -
Advanced Packaging Warpage Mitigation: Research Advances in Incorporating Negative Coefficient of Thermal Expansion Materials into Epoxy Molding Compounds and Underfills
Semiconductor Engineering USA Overview Active research is progressing on utilizing negative coefficient of thermal expansion (CTE) materials in epoxy molding compounds (EMC) and underfills to effectively mitigate warpage in large semicon... -
NIST and UCSD Develop Predictive Modeling for Cure Behavior and Thermal Endurance of Advanced Packaging Epoxy Underfills
Semiconductor Engineering USA Overview Researchers from the National Institute of Standards and Technology (NIST) and the University of California San Diego (UCSD) have published a technical paper detailing a new modeling technique to ac... -
TOWA Contributes to AI Semiconductor Thermal Management and Productivity with ‘Mold Underfill (MUF)’ Technology via US-JOINT Platform
Resonac Japan Overview TOWA is accelerating customer concept validation through its 'US-JOINT' co-creation platform for next-generation semiconductor packaging technology. Addressing thermal management challenges in AI semiconductors, TO... -
Glass Core Substrates Poised to Resolve Warpage Issues in Data Center AI Accelerators by 2030, Addressing ABF Substrate Limitations
Tom's Hardware USA Overview The increasing demand for high-performance AI accelerators in data centers highlights critical supply shortages and material limitations, particularly warpage issues with large-scale ABF (Ajinomoto Build-up Fi... -
Mitsubishi Chemical Unveils M-Filleris™ NTE: A Negative Thermal Expansion Solution to Semiconductor Package Warpage
Mitsubishi Chemical Corporation Japan Overview Mitsubishi Chemical has commercialized M-Filleris™ NTE, a novel negative thermal expansion (NTE) ceramic filler engineered to precisely control the coefficient of thermal expansion (CTE) in ... -
Master Bond Offers Low-Stress, Low-Outgassing, Fast-Curing Glob Top Epoxy Compounds for Semiconductor Chip and Wire Bond Protection
Master Bond Inc. USA Overview Master Bond is supplying high-performance glob top epoxy compounds for the encapsulation of semiconductor chips and wire bonds in chip-on-board (COB) applications. These formulations provide effective protec... -
Master Bond Announces EP30LTE-2, a Two-Part Epoxy System Achieving Ultra-Low CTE (10-13 x 10^-6 in/in/°C) and High Dimensional Stability for Aerospace, Optical, and Electronic Industries
Master Bond Inc. USA Overview Master Bond has launched EP30LTE-2, a groundbreaking two-part epoxy system characterized by an exceptionally low coefficient of thermal expansion (CTE) of 10-13 x 10^-6 in/in/°C, coupled with outstanding dim... -
Master Bond Unveils Dimensionally Stable Epoxy Adhesive Systems Achieving Low Shrinkage and Ultra-Low CTE for Semiconductor and Optoelectronic Packaging
Master Bond Inc. USA Overview Master Bond has introduced dimensionally stable epoxy adhesive systems specifically engineered for semiconductor assembly, optoelectronic packaging, and high-voltage sensor potting applications. These system...
