Die Attach– tag –
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New Low-Temperature Sintering Die Attach Material Revolutionizes IGBT Module Manufacturing for Enhanced Performance
Advanced Power Semiconductor Technology Global Overview A new low-temperature sintering die attach material for IGBT modules has been announced, offering high thermal conductivity and reliability while reducing stress on heat-sensitive c... -
Sintered Silver Die Attach Materials Demonstrate 60-70% Lower Crack Growth Rate Than Lead-Free Alloys
PatSnap Eureka Global Overview Indium Corporation's sintered silver die attach materials exhibit significantly superior crack propagation resistance compared to conventional lead-free alloys. The technology creates a porous microstructur... -
Henkel Expert Reveals Material Innovations Critical for Power Electronics Reliability and Thermal Management
EE Times USA Overview Dr. Bruchak Conley from Henkel discussed the pivotal role of material evolution in power electronics, emphasizing that die attach encapsulants and thermal interface materials (TIMs) dictate module reliability under ...
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