Die Attach– tag –
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Indium Corporation to Showcase Advanced Materials for AI at SEMICON Taiwan, Including High-Thermal-Conductivity Sintering Pastes and TIMs
Indium Corporation USA Overview Indium Corporation will exhibit innovative materials enabling AI technology at SEMICON Taiwan 2026, including Heterogeneous Integration and Assembly (HIA) products and groundbreaking Thermal Interface Mate... -
Advanced Die Attach Solder Paste for High-Power Packaging: Achieving >60-70 W/m·K Thermal Conductivity and Precision Filling
Global SMT & Packaging Global Overview A Global SMT & Packaging article emphasizes the critical role of die attach solder paste in high-power packaging, achieving excellent thermal conductivity of 60-70 W/m·K (and >70 W/m·K with C... -
Master Bond Offers High-Strength, High-Reliability Die Attach Epoxy Adhesives for Microelectronics
Master Bond USA Overview Master Bond provides die attach epoxy adhesives for microelectronic semiconductor packaging and chip-on-board assemblies, featuring high bond strength, thermal cycling resistance, mechanical shock/vibration resis... -
Henkel Unveils Loctite ABLESTIK CDF900 Series Conductive Die Attach Film with >8 W/m-K Thermal Conductivity for AI and HPC Packages
SpecialChem Germany Overview Henkel Adhesive Technologies has introduced the new Loctite ABLESTIK CDF900 series conductive die attach film (cDAF), revolutionizing advanced packaging for AI accelerators and HPC processors. This innovative... -
Indium Corporation Showcases High Thermal Conductivity TIMs and Sintering Pastes for AI at SEMICON Taiwan
Indium Corporation USA Overview Indium Corporation exhibited innovative materials supporting AI technology at SEMICON Taiwan, highlighting Heat-Spring® compressible metal TIMs and solder TIMs for superior thermal conductivity in high-pow... -
Epsilon Unveils Advanced Semiconductor Packaging Materials at ASPS 2026 for AI Data Centers: Die Attach Copper Paste Improves Thermal Dissipation and Reduces Cost
The Elec Inc. South Korea Overview Epsilon showcased advanced packaging material solutions at the 2026 Advanced Semiconductor Packaging & Chiplet Show (ASPS 2026), targeting advancements in AI data centers. Exhibited materials includ... -
Indium Corporation Unleashes Low-Temperature Silver Sintering Paste to Propel GaN Power Device Evolution
Indium Corporation USA Overview Indium Corporation has launched a novel low-temperature silver sintering paste specifically designed for Gallium Nitride (GaN) power devices. This advanced material enables high-reliability die attachment ... -
Henkel Launches LOCTITE ABLESTIK CDF900 Series: Next-Gen Conductive Die Attach Film Achieving Over 8 W/m-K Thermal Conductivity for AI, 5G/6G, and HPC
Henkel Germany Overview Henkel Adhesive Technologies unveiled its LOCTITE ABLESTIK CDF900 series, a next-generation conductive die attach film (cDAF) offering thermal conductivity exceeding 8 W/m-K, at SEMICON Taiwan 2026. This advanced ... -
Innox Advanced Materials Surpasses Previous Year’s SpaceX Revenue in Seven Months, Diversifies into AI Semiconductor and EV Battery Materials
BigGo Finance South Korea Overview Innox Advanced Materials, a Korean company, achieved a significant supply expansion to SpaceX, with cumulative revenue in the first seven months of 2026 surpassing the previous year's total. Beyond aero... -
Indium Corporation Expert to Present TIM Solutions for AI Thermal Challenges at IMAPS ThermCon, Focusing on Gold-Based Die Attach Preforms for High-Power Laser and RF Applications
Indium Corporation USA Overview Indium Corporation expert Ryan Mayberry will present research on Thermal Interface Material (TIM) solutions for AI thermal challenges at IMAPS ThermCon. The study focuses on advanced gold-based precision d...
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