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IMAPS Device Packaging Conference 2026 Details 3D/2.5D Packaging Advances: FOPLP, Hybrid Bonding Drive Demand
IMAPS USA Overview Professional Development Courses at IMAPS Device Packaging Conference 2026 provided in-depth insights into current and future 3D/2.5D packaging processes and technologies. Key innovations like Fan-Out Panel Level Packa... -
ECTC 2026 Highlights Advanced Packaging Future: Glass Substrates and FOPLP at the Core of System Innovation
Advanced Packaging Magazine USA Overview ECTC 2026 emphasized a structural shift in semiconductor innovation, moving beyond transistor scaling to packaging and integration technologies. Noteworthy advancements in heterogeneous integratio... -
ASE Technology Bets Big on AI: $10.5 Billion Record Capex to Double Advanced Packaging by 2027
TrendForce Taiwan Overview ASE Technology Holding is significantly increasing its 2026 capital expenditure to a record $10.5 billion, aiming to double the revenue of its leading-edge advanced packaging (LEAP) business by 2027. This ambit... -
Fraunhofer Unveils APECS Pilot Line: Accelerating Advanced Packaging and Heterogeneous Integration Under EU Chips Act
Fraunhofer-Institut für Angewandte Festkörperphysik IAF Germany Overview Under the EU Chips Act, Fraunhofer IAF has established APECS, a new pilot line for advanced packaging and heterogeneous integration, designed to bridge microelectro... -
Powertech and Broadcom Launch $400M Singapore Joint Venture to Expand FOPLP Manufacturing for AI ASICs
Taipei Times Taiwan Overview Powertech Technology has approved a $400 million joint venture with Broadcom in Singapore to establish advanced Panel-Level Packaging (PLP) manufacturing capabilities, focusing on additive fine-line RDL techn... -
Powertech Technology and Broadcom Establish $400 Million Singapore FOPLP Joint Venture for AI ASICs Manufacturing
DigiTimes Taiwan Overview Powertech Technology (PTI) has approved a $400 million investment in a joint venture with Broadcom in Singapore to build Fan-Out Panel-Level Packaging (FOPLP) manufacturing capacity. This strategic move aims to ... -
JCET Shares Soar on Major Investment in Advanced Chip Packaging Capabilities
Morningstar (Dow Jones News) China Overview Shares of China-based OSAT leader JCET Group surged following the announcement of a significant new investment in its advanced chip packaging capabilities. This investment aims to substantially... -
ASE to Commence FOPLP Mass Production by End-2026, Launching 15 Expansion Projects Amid AI Chip Boom
TrendForce Taiwan Overview ASE Technology, the world's largest semiconductor packaging and testing services provider, announced plans to begin mass production of Fan-out Panel-Level Packaging (FOPLP) by the end of 2026. This initiative, ... -
TSMC and Amkor Sign 10-Year Advanced Packaging Deal in Arizona, Amkor to Invest $7B for CoWoS Supply Boost and US Ecosystem Build-out
Bignewsnetwork India Overview TSMC and Amkor have signed a 10-year strategic agreement to expand semiconductor packaging capabilities in Arizona, USA. This partnership focuses on cutting-edge packaging technologies, including TSMC's InFO... -
ASE to Raise Advanced Packaging Prices by Up to 20% by 2026 Amid Soaring AI Demand
AXTEK Technology Company Limited Taiwan Overview ASE Technology Holding, the world's largest OSAT provider, plans to increase its backend wafer packaging prices by 5-20% in 2026, driven by a surge in AI-powered semiconductor demand. With...
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