Film– tag –
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Oerlikon Unveils High-Performance PFAS-Free Thin Film Coatings, Enhancing Industrial Wear Resistance and Chemical Stability
Oerlikon Switzerland Overview Oerlikon has introduced new high-performance, PFAS-free thin film coating technologies for industrial applications. These advanced Diamond-Like Carbon (DLC) and ceramic coatings offer superior wear resistanc... -
SILIKE Launches PFAS-Free “SILIMER” PPA Series for PE Film Extrusion, Eliminating Melt Fracture and Sharkskin Without Fluoropolymers
Silike China Overview SILIKE has launched PFAS-free Polymer Processing Aids (PPAs), the "SILIMER" series, to replace fluoropolymer-based solutions in PE film extrusion. These non-fluorinated additives reduce melt fracture and sharkskin b... -
IMPLICIT Project Pioneers Multimodal Recycling of Composite Manufacturing Waste, Fueling Circular Economy in Automotive, Textile, and Urban Furniture
AZoM スペイン Overview The IMPLICIT project is developing advanced multimodal recycling strategies to transform auxiliary composite manufacturing waste, such as vacuum bags and films, into high-value monomers and oligomers. By integratin... -
Oerlikon Drives PFAS-Free Coating Innovation with DLC and Ceramic Alternatives, Meeting Global Regulations and Delivering High Performance Across Industries
Oerlikon Switzerland Overview Oerlikon is advancing PFAS-free thin film coatings, like Diamond-Like Carbon (DLC) and ceramic coatings, as high-performance alternatives across diverse industrial applications. These new solutions aim to ma... -
Asahi Kasei Unveils Photosensitive Film for Panel-Level Semiconductor Packaging, Enabling Advanced 3D Integration
ThePackHub Japan Overview Asahi Kasei has developed an innovative photosensitive film, merging its PIMEL photosensitive polyimide and SUNFORT dry film photoresist technologies, for panel-level semiconductor packaging. This film facilitat... -
Ajinomoto’s Critical Chip Film, ABF, Faces Supply Test as Escalating AI Demand Mounts Pressure for Price Hikes
digitimes Taiwan Overview Global AI chip demand is putting new pressure on the supply of Ajinomoto Build-up Film (ABF), a key material for advanced semiconductor packaging. Ajinomoto faces increasing pressure to raise ABF prices, making ... -
Ajinomoto’s ABF Price Stability Strategy Amid Surging AI Demand Prompts Investor Re-evaluation of Portfolio Focus
Simply Wall St News Japan Overview Despite record financial results and robust demand for AI-related Ajinomoto Build-up Film (ABF), Ajinomoto Corporation plans to maintain ABF prices and expand production capacity through 2032. This stra... -
Resonac CEO Navigates Soaring AI Chip Demand and China Supply Chain Risks, Bolstered by Key Patent Ruling
Crypto Briefing Japan Overview The CEO of Resonac Holdings, a key supplier of non-conductive film for HBM chips and liquid encapsulants for 2.5D semiconductor packages, emphasized strategies for managing surging AI chip demand while miti... -
Ajinomoto to Secure ABF Supply Capacity for AI Chip Demand Until 2030, Prioritizing Production Expansion Over Price Hikes
GIGAZINE Japan Overview Ajinomoto announced its capability to meet the surging demand for Ajinomoto Build-Up Film (ABF), a critical interlayer dielectric for advanced semiconductor packaging, until 2030, driven by the exponential growth ... -
ExxonMobil Signature Polymers Develops Monomaterial PE Films with Up to 35% PCR Content for Hygiene Compression Packaging
Plastics Today USA Overview ExxonMobil Signature Polymers has engineered innovative monomaterial polyethylene (PE) films incorporating up to 35% post-consumer recycled (PCR) content, specifically for hygiene compression packaging applica...
