Henkel– tag –
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LOCTITE® Unveils Leak-Free Anaerobic Sealants for Hydrogen Systems: A Next-Gen Solution with Pressure, Temperature, and Vibration Resistance
Assembtek Germany Overview The LOCTITE® brand has launched anaerobic sealants as a next-generation solution for hydrogen system sealing. These sealants cure in the absence of air between metal surfaces, forming durable, leak-free thermos... -
Unpacking the EV Battery Pack Thermal Gap Filler Market: Growth, Key Players, and Technological Imperatives
Inkrich Blog Japan Overview The inkrich blog reveals a rapidly expanding market for thermal gap fillers in electric vehicle (EV) battery packs, driven by the escalating demand for enhanced EV performance and efficiency. Critical for batt... -
Henkel Launches 90% Self-Healing, Multi-Functional Polyurethane Coating Doubling Corrosion Resistance for Offshore Wind Turbines
Assembtek Germany Overview Henkel has introduced a multi-functional polyurethane coating with 90% self-healing efficiency, designed to significantly enhance corrosion protection for offshore wind power installations. This innovation doub... -
Henkel Unveils Low-Viscosity Technomelt PA 6370 Hot Melt Adhesive for Precision Small-Gap Protection in Electronic Assemblies
Adhesives/Sealants.org (Henkel) Germany Overview Henkel has introduced Technomelt PA 6370, a new polyamide-based, low-viscosity hot melt adhesive specifically developed for sealing narrow gaps and intricate electronic components. This in... -
Henkel Invests in Automotive Structural Adhesives Capacity Expansion, Accelerating Multi-Material Lightweighting
Adhesives & Sealants Industry Germany Overview Henkel has announced a strategic investment in expanding its production capacity for automotive structural adhesives to meet the growing demand for lightweighting and dissimilar material joi... -
Henkel Unveils High-Performance Underfill Material for Advanced Logic and Memory Packaging, Boosting Production Efficiency
Advanced Packaging Journal Germany Overview Henkel has introduced a new high-performance underfill material designed for advanced logic and memory packaging technologies like flip-chip and chiplets. This material significantly improves d... -
Henkel Offers Liquid Compression Molding (LCM) Solutions for Wafer-Level and Panel-Level Packaging
Henkel Adhesives Germany Overview Henkel provides encapsulation materials that enable advanced semiconductor packaging technologies where ICs are molded directly on wafers or panels prior to subsequent processing, using Liquid Compressio... -
Henkel Delivers Advanced Semiconductor Packaging Materials to Tackle Thermal and Mechanical Challenges in 2.5D/3D Packaging
Henkel Adhesives Germany Overview Henkel offers a diverse portfolio of advanced semiconductor packaging solutions, including lid and stiffener adhesives, EMI shielding, liquid compression molding solutions, and underfills. These material... -
Henkel Establishes North American Battery Application Center to Accelerate EV Battery Technology Development
Henkel Adhesives Germany Overview Henkel has launched a dedicated Battery Application Center in North America to provide an agile development approach, enabling the long-term success of the electric vehicle (EV) market. The center offers... -
Henkel Launches LOCTITE MS 9650 Silane-Modified Adhesive for Automotive Displays and TEROSON EP 52 Next-Gen Structural Adhesive for EVs
Henkel Adhesives / MarkNtel Advisors Germany Overview Henkel has introduced two innovative adhesive solutions for the automotive market: LOCTITE MS 9650, a silane-modified polymer adhesive designed for automotive display components and l...
