Indium Corporation– tag –
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Indium Corporation to Showcase Advanced Materials for AI at SEMICON Taiwan, Including High-Thermal-Conductivity Sintering Pastes and TIMs
Indium Corporation USA Overview Indium Corporation will exhibit innovative materials enabling AI technology at SEMICON Taiwan 2026, including Heterogeneous Integration and Assembly (HIA) products and groundbreaking Thermal Interface Mate... -
Indium Corporation’s Jason Chou to Present “Material Solutions for AI Industry” at SEMICON Taiwan
Indium Corporation USA Overview Indium Corporation's Jason Chou will deliver a presentation titled "Material Solutions for AI Industry from Packaging to System Assembly" at SEMICON Taiwan, held from September 2-4, 2026. His talk will foc... -
Indium Corporation Showcases High Thermal Conductivity TIMs and Sintering Pastes for AI at SEMICON Taiwan
Indium Corporation USA Overview Indium Corporation exhibited innovative materials supporting AI technology at SEMICON Taiwan, highlighting Heat-Spring® compressible metal TIMs and solder TIMs for superior thermal conductivity in high-pow... -
Indium Corporation to Unveil High-Reliability Power Device Packaging Solutions, Including SiC and Cu Sintering Pastes, at PCIM Asia 2026
Indium Corporation USA Overview Indium Corporation will showcase its next-generation high-reliability packaging solutions for power electronics at PCIM Asia 2026. Key offerings include InFORCE®MF pressure silver sintering paste for SiC d... -
Indium Corporation Unleashes Low-Temperature Silver Sintering Paste to Propel GaN Power Device Evolution
Indium Corporation USA Overview Indium Corporation has launched a novel low-temperature silver sintering paste specifically designed for Gallium Nitride (GaN) power devices. This advanced material enables high-reliability die attachment ... -
Indium Corporation Unveils Next-Gen Copper Sintering Paste for High-Power Semiconductors, Achieving Gold/Silver-Free High Reliability Die-Attach
Indium Corporation USA Overview Indium Corporation presented a next-generation copper sintering paste for high-power semiconductor applications at ICEPT 2026. This innovative paste provides high reliability, exceptional thermal and elect... -
Indium Corporation Unveils Plating-Free Copper Sintering Paste and Bi-Free Mid-Temp Solder at ICEPT 2026
Indium Corporation USA Overview Indium Corporation will present two significant advancements at ICEPT 2026: a next-generation copper sintering paste for high-power semiconductors and a lead-free, bismuth-free indium-containing mid-temper... -
Indium Corporation Expert to Present TIM Solutions for AI Thermal Challenges at IMAPS ThermCon, Focusing on Gold-Based Die Attach Preforms for High-Power Laser and RF Applications
Indium Corporation USA Overview Indium Corporation expert Ryan Mayberry will present research on Thermal Interface Material (TIM) solutions for AI thermal challenges at IMAPS ThermCon. The study focuses on advanced gold-based precision d... -
Indium Corporation Unveils AuLTRA® 75 Gold-Based Die-Attach Preforms for 5G, Military, and Aerospace GaN Devices at IMS
Industrial Electronics USA Overview Indium Corporation announced it will feature its high-reliability, gold-based precision die-attach preforms at the International Microwave Symposium (IMS). A highlight is AuLTRA® 75, an off-eutectic Au... -
Sintered Silver Die Attach Materials Demonstrate 60-70% Lower Crack Growth Rate Than Lead-Free Alloys
PatSnap Eureka Global Overview Indium Corporation's sintered silver die attach materials exhibit significantly superior crack propagation resistance compared to conventional lead-free alloys. The technology creates a porous microstructur...
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