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TANAKA to Unveil Advanced High-Conductivity Die-Attach Materials for Next-Gen Power Semiconductors at SEMICON Southeast Asia 2026
田中貴金属グループ Japan Overview TANAKA Precious Metals will showcase high-thermal-conductivity and high-reliability silver sintering pastes and AgSn TLP sheets for next-generation SiC and GaN semiconductors at SEMICON Southeast Asia 20... -
Direct Die-Attach Microchannel Cooling with Sintered Silver Boosts SiC Inverter Thermal Performance
PatSnap Eureka USA Overview An innovative thermal management solution combining direct die-attach microchannel cooling with sintered silver bonding is proposed to combat overheating in high-power-density SiC inverters. By directly joinin...
