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Indium Corporation to Showcase Advanced Materials for AI at SEMICON Taiwan, Including High-Thermal-Conductivity Sintering Pastes and TIMs
Indium Corporation USA Overview Indium Corporation will exhibit innovative materials enabling AI technology at SEMICON Taiwan 2026, including Heterogeneous Integration and Assembly (HIA) products and groundbreaking Thermal Interface Mate... -
Indium Corporation’s Jason Chou to Present “Material Solutions for AI Industry” at SEMICON Taiwan
Indium Corporation USA Overview Indium Corporation's Jason Chou will deliver a presentation titled "Material Solutions for AI Industry from Packaging to System Assembly" at SEMICON Taiwan, held from September 2-4, 2026. His talk will foc... -
Advanced Die Attach Solder Paste for High-Power Packaging: Achieving >60-70 W/m·K Thermal Conductivity and Precision Filling
Global SMT & Packaging Global Overview A Global SMT & Packaging article emphasizes the critical role of die attach solder paste in high-power packaging, achieving excellent thermal conductivity of 60-70 W/m·K (and >70 W/m·K with C... -
Indium Corporation Showcases High Thermal Conductivity TIMs and Sintering Pastes for AI at SEMICON Taiwan
Indium Corporation USA Overview Indium Corporation exhibited innovative materials supporting AI technology at SEMICON Taiwan, highlighting Heat-Spring® compressible metal TIMs and solder TIMs for superior thermal conductivity in high-pow... -
Indium Corporation to Unveil High-Reliability Power Device Packaging Solutions, Including SiC and Cu Sintering Pastes, at PCIM Asia 2026
Indium Corporation USA Overview Indium Corporation will showcase its next-generation high-reliability packaging solutions for power electronics at PCIM Asia 2026. Key offerings include InFORCE®MF pressure silver sintering paste for SiC d... -
Epsilon Unveils Advanced Semiconductor Packaging Materials at ASPS 2026 for AI Data Centers: Die Attach Copper Paste Improves Thermal Dissipation and Reduces Cost
The Elec Inc. South Korea Overview Epsilon showcased advanced packaging material solutions at the 2026 Advanced Semiconductor Packaging & Chiplet Show (ASPS 2026), targeting advancements in AI data centers. Exhibited materials includ... -
Indium Corporation Unleashes Low-Temperature Silver Sintering Paste to Propel GaN Power Device Evolution
Indium Corporation USA Overview Indium Corporation has launched a novel low-temperature silver sintering paste specifically designed for Gallium Nitride (GaN) power devices. This advanced material enables high-reliability die attachment ... -
Heraeus Unleashes Pressureless Silver Sintering Pastes to Propel High-Power SiC Modules in EV Inverters
Heraeus Electronics News Germany Overview Heraeus has introduced two advanced silver sintering pastes designed to revolutionize die attachment for high-power Silicon Carbide (SiC) modules, particularly within electric vehicle (EV) invert... -
Indium Corporation Unveils Next-Gen Copper Sintering Paste for High-Power Semiconductors, Achieving Gold/Silver-Free High Reliability Die-Attach
Indium Corporation USA Overview Indium Corporation presented a next-generation copper sintering paste for high-power semiconductor applications at ICEPT 2026. This innovative paste provides high reliability, exceptional thermal and elect... -
Indium Corporation Unveils Plating-Free Copper Sintering Paste and Bi-Free Mid-Temp Solder at ICEPT 2026
Indium Corporation USA Overview Indium Corporation will present two significant advancements at ICEPT 2026: a next-generation copper sintering paste for high-power semiconductors and a lead-free, bismuth-free indium-containing mid-temper...
