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Lenovo Legion Y70 2026 Gaming Phone Boosts Cooling with 12 W/mK Liquid Metal and High-Conductivity Gel
Cashkr China Overview The Lenovo Legion Y70 2026 gaming phone features a significantly enhanced cooling system, combining a 5,500 mm² vapor chamber with 12 W/mK liquid metal thermal conductivity and high thermal conductive gel. This setu... -
Heraeus Announces New Pressureless Sintering Paste for High-Power GaN Devices, Balancing Cost and Performance
Semiconductor Today Germany Overview Heraeus has announced an innovative pressureless sintering paste specifically for high-power GaN (gallium nitride) devices. This material achieves high bonding strength and excellent thermal conductiv... -
New Silver Sinter Paste Revolutionizes Thermal Management for SiC Power Modules, Boosting EV and Renewables
Power Electronics Magazine Global Overview A new silver sinter paste with high thermal conductivity and excellent reliability has been unveiled for SiC (silicon carbide) power modules. This advanced bonding material significantly enhance... -
Sheen Technology Enhances EV Range and Safety through Advanced Battery Thermal Management
Sheen Technology China Overview Sheen Technology emphasizes that effective thermal management is crucial for extending EV battery range and recommends precise application of thermal pastes or greases. Applying thin, uniform gap filler la... -
PCIM Europe 2026 Unveils Innovations in Power Module Reliability and SiC/GaN Power Semiconductor Packaging Technologies
MacDermid Alpha, PCIM Europe Germany Overview PCIM Europe 2026 in Nuremberg, Germany, featured significant innovations in power module reliability and next-generation power semiconductor packaging. MacDermid Alpha unveiled underfills, hi... -
Henkel Adhesives Innovates Advanced Semiconductor Packaging Materials for High-Performance Computing and Generative AI
Henkel Adhesives Germany Overview Henkel is developing innovative material solutions for advanced semiconductor packaging, addressing demands for higher performance, greater integration, and improved efficiency in a rapidly evolving tech... -
Sn-Coated Cu Solder Paste via Transient Liquid Phase Bonding Offers High-Reliability for Power Device Packaging
MDPI Switzerland Overview This MDPI paper reports on the potential of Sn-coated Cu solder paste for power device packaging using Transient Liquid Phase Bonding (TLPB). While Cu offers excellent electrical and thermal conductivity, its ox... -
Henkel Expert Reveals Material Innovations Critical for Power Electronics Reliability and Thermal Management
EE Times USA Overview Dr. Bruchak Conley from Henkel discussed the pivotal role of material evolution in power electronics, emphasizing that die attach encapsulants and thermal interface materials (TIMs) dictate module reliability under ... -
Heraeus Electronics Unveils Advanced Die-Attach Materials for High-Reliability Power Electronics at PCIM Europe 2026
Heraeus Electronics Germany Overview Heraeus Electronics unveiled cutting-edge material technologies for power electronics at PCIM Europe 2026. New offerings include mAgic® PE340 silver pressure sintering paste for high-density packaging... -
CTE-Gradient Interconnect Technology Drastically Reduces Thermal Cycling Damage in SiC Inverters
PatSnap Eureka USA Overview PatSnap Eureka reveals an innovative approach to mitigate thermal cycling damage in SiC power inverter modules by creating biomimetic interconnects with a Coefficient of Thermal Expansion (CTE) gradient. This ...
