PCB– tag –
-
AT&S Commits €2 Billion to Malaysian Expansion, Supercharging AI IC Substrate Capacity for AMD and Key Tech Partners
EQS News オーストリア Overview Austrian IC substrate manufacturer AT&S is undertaking a significant €1.5-2 billion expansion of its Kulim, Malaysia plant to dramatically increase high-end IC substrate production for AI and high-perfo... -
AT&S Unveils €2 Billion Kulim Expansion to Fuel AI Boom with Advanced IC Substrates and PCBs
AT&S Official Press Release オーストリア Overview AT&S is undertaking a monumental €1.5 billion to €2 billion expansion of its Kulim, Malaysia, manufacturing facility. Driven by long-term commitments from industry leaders like AMD, t... -
Samsung Electronics Leads Advanced Packaging with Projected Triple HBM Sales and Thinnest 0.65mm LPDDR DRAM Package Development
Simply Wall St South Korea Overview Samsung Electronics is leading advanced packaging advancements by leveraging extensive in-house expertise to streamline production cycles and reduce lead times. The company projects its High Bandwidth ... -
Fengling New Materials: Expert Manufacturer of UV-Curable Adhesives for Electronics, Medical, and Optical Industries
YouTube (Fengling New Materials) China Overview Fengling New Materials specializes in UV-curable adhesives, epoxy adhesives, and advanced bonding materials for diverse industrial applications including electronics, medical devices, optic... -
Dymax to Showcase Latest UV/LED-Curable Adhesives and Technologies for Battery and Electronics Manufacturing at The Battery Show Europe 2026
PresseBox Germany Overview Dymax is set to showcase its newest UV/LED-curable materials and technological innovations for battery and electronics manufacturing at The Battery Show Europe 2026. Highlights include new solutions for camera ... -
Henkel Unveils Ultra-Low Viscosity Technomelt PA 6370 for Rugged Electronics Protection and Accelerated Manufacturing
Henkel Germany Overview Henkel has launched Technomelt PA 6370, an ultra-low melt viscosity hot melt material designed for robust protection of challenging electronic device designs. This new polyamide-based material offers a high-speed,...
12