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Samsung Electro-Mechanics and Qualcomm Jointly Develop Organic Bridge Technology for 2.1D AI Semiconductor Packaging
The Elec South Korea Overview Samsung Electro-Mechanics and Qualcomm are collaboratively developing an advanced "organic bridge" technology for 2.1D packaging in AI semiconductors. This innovation utilizes organic materials, akin to PCBs... -
NVIDIA to Boost CoWoS Production Capacity by 3.5x to Over 120,000 Wafers/Month by End-2026, Securing HBM4 Supply
SemiconductorX USA Overview NVIDIA plans to scale its CoWoS (Chip-on-Wafer-on-Substrate) production capacity by 3.5x to 120,000–130,000 wafers per month by the end of 2026, up from 35,000, driven largely by its own demand. The company is... -
WEVO-CHEMIE Develops High-Insulation, Thermally Conductive Polyurethane Potting System for EV Battery BMS
WEVO-CHEMIE GmbH Germany Overview WEVO-CHEMIE GmbH has developed WEVOPUR 60210 FL T, a polyurethane potting system for multilayer PCBs in EV battery management systems (BMS), offering 0.8 W/m·K thermal conductivity and dielectric strengt... -
Simmtech to Invest 400 Billion Won in Next-Gen AI Server Substrate Production: Capacity Expansion Starts 2028
The Elec Inc. South Korea Overview Simmtech announced a phased 400 billion won (approx. $300 million) investment to expand production capacity for next-generation substrates used in AI servers. New facilities in Cheongju will boost outpu... -
High-End ABF Substrate Shortage Intensifies Due to Massive AI Chips: Taiwanese Makers & Equipment Suppliers Face Fierce Competition
Medium (by Julien Nauy) International Overview The high-end ABF (Ajinomoto Build-up Film) substrate market for AI chips faces a severe supply shortage, reflecting a 're-evaluation of manufacturing difficulty' distinct from traditional AB... -
Dymax Launches 9310 Dual-Cure Adhesive for High-Reliability PCB Reinforcement, Streamlining Underfill Alternatives for Advanced Electronics and AI Hardware
PR Newswire USA Overview Dymax has launched its 9310 adhesive, an innovative light and secondary heat-cure solution engineered for reinforcing fine-pitch, leadless components on printed circuit boards in advanced electronics and AI hardw... -
SiC Power Modules Get a Boost: Advanced Packaging with AMB and Embedded Die Transforms EV and AI Data Centers
[Industry Publication/Research] Global Overview Advanced packaging technologies for Silicon Carbide (SiC) power modules are dramatically improving thermal management and power density in electric vehicle (EV) inverters and AI data center... -
AtlasPCB Releases BGA Underfill Selection Guide Comparing Capillary Flow and Reworkable Formulations for Automotive, Aerospace
AtlasPCB Unknown Overview AtlasPCB has published a BGA (Ball Grid Array) underfill selection guide as part of its PCB engineering insights blog series. The article comprehensively compares capillary flow, molded underfills, and reworkabl... -
AT&S Transforms Austrian Fehring Plant into Innovation Hub with €10M Investment, Bolstering Advanced PCB & Thermal Solutions
AT&S (Press Release) Austria Overview AT&S, a global leader in high-end PCBs and IC substrates, is investing approximately €10 million in its Fehring plant in Austria. This strategic upgrade aims to establish the facility as an innov... -
Ring PCB Details Advanced Thermal Management for High-Power PCBAs: Strict TIM Application, Customized Thick Copper Reflow, and High-Density Thermal Via Arrays
Ring PCB China Overview Ring PCB provides solutions for ensuring thermal stability in high-power Printed Circuit Board Assembly (PCBA) systems through rigorous application of Thermal Interface Materials (TIMs), customized reflow temperat...
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