Samsung Electronics– tag –
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TRUMPF Resolves Glass Substrate TGV Coating Bottleneck with High-Power HiPIMS, Accelerating Next-Gen AI Chip Packaging
TRUMPF Germany Overview TRUMPF has introduced a High-Power Impulse Magnetron Sputtering (HiPIMS) approach to address a key manufacturing challenge in next-generation AI chip packaging: reliably coating millions of minute Through-Glass Vi... -
High-End ABF Substrate Shortage Intensifies Due to Massive AI Chips: Taiwanese Makers & Equipment Suppliers Face Fierce Competition
Medium (by Julien Nauy) International Overview The high-end ABF (Ajinomoto Build-up Film) substrate market for AI chips faces a severe supply shortage, reflecting a 're-evaluation of manufacturing difficulty' distinct from traditional AB... -
Korean Tech Giants Accelerate AI Substrate Production Amid Soaring Demand, Nearing 90% Utilization
TrendForce Taiwan Overview The proliferation of AI data centers has created a critical shortage and driven up prices for advanced substrates essential for GPUs and HBM. In response, Samsung Electro-Mechanics (SEM) and LG Innotek are aggr... -
Glass Substrates Emerge as Key Breakthrough for Next-Gen AI Chip Packaging: Intel, TSMC, Samsung Accelerate Development
Industry Analyst International Overview Glass substrates are increasingly recognized as a critical breakthrough for next-generation AI chip packaging, with industry leaders like Intel, TSMC, and Samsung Electro-Mechanics accelerating the... -
AI Supply Chain Maxed Out: 40-Week Lead Times Become New Normal as HBM Emerges as Primary Bottleneck Over TSMC CoWoS
Markets Insider USA Overview The AI supply chain faces severe constraints, with 40-week lead times becoming the new norm. High Bandwidth Memory (HBM) has replaced TSMC's CoWoS advanced packaging as the primary bottleneck, driven by NVIDI... -
Samsung Biologics to Acquire PolyPeptide Group for $1.8B, Expanding CDMO Capabilities into Peptide Therapeutics with $2.2B Capital Raise
Endpoints News South Korea Overview Samsung Biologics announced a capital raise of nearly $2.2 billion to fund its long-term growth strategy, including the acquisition of PolyPeptide Group for $1.8 billion. This acquisition will signific... -
Samsung Display Announces Mass Production of 24.5-inch FHD QD-OLED Panels Optimized for Esports at Gamescom 2026
Business Wire / Samsung Display South Korea Overview Samsung Display announced plans to mass-produce 24.5-inch FHD QD-OLED panels optimized for esports and FPS gaming by year-end, unveiled at Gamescom 2026. These displays offer an ultra-... -
SK hynix’s MR-MUF and Samsung’s TC-NCF Revolutionize Thermal Management in AI Semiconductor HBM: Driving Advanced Packaging Evolution
USD Analytics Global Overview The evolution of AI is driving significant changes in semiconductor packaging and High Bandwidth Memory (HBM) technologies, with SK hynix's Advanced MR-MUF and Samsung's TC-NCF technologies solving critical ... -
Samsung Electro-Mechanics Boosts FC-BGA Substrate Capacity by 20% for AI/HPC, Enhances Competitiveness with Fine-Pitch Wiring
The Korea Economic Daily South Korea Overview Samsung Electro-Mechanics (SEMCO) announced a 20% expansion of its high-end FC-BGA substrate production capacity in South Korea, driven by surging demand from AI/HPC applications. This strate... -
Samsung Biologics Announces KRW 3 Trillion ($2.18B) Rights Offering to Fund PolyPeptide Group Acquisition and Bio Campus II Expansion, Strengthening CDMO Leadership
PR Newswire South Korea Overview Samsung Biologics has announced a substantial KRW 3 trillion (approximately $2.18 billion) rights offering to finance its acquisition of PolyPeptide Group and the expansion of its Bio Campus II. This stra...
