Samsung Electronics– tag –
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Samsung Electro-Mechanics Fast-Tracks Glass Substrates for AI Chip Packaging, Challenging Japanese Rivals for 2028 Mass Production
BusinessKorea South Korea Overview Samsung Electro-Mechanics (SEM) is accelerating its pursuit of glass substrates for AI chip packaging, targeting mass production by 2028 through its 'GlaSSEM' joint venture with Dongwoo Fine-Chem. This ... -
HBM Supply Crunch: Long Backlogs for Bonding Equipment and Low Yields Create Bottleneck, Constraining AI Demand Until 2027
AI CERTs News USA Overview HBM stack manufacturing demands Through Silicon Vias (TSV) and high-precision bonding equipment, with low yield tolerance posing an industry challenge. Limited vendors for these specialized tools mean HANMI, a ... -
Samsung HBM4 Yield Dramatically Improves from Under 60% to 80%; SK Hynix Labor Talks Stall, Intensifying AI Memory Race
TrendForce Taiwan Overview Samsung's HBM4 yield has dramatically improved from under 60% at launch to 80% within months, according to Seoul Economic Daily. This swift process enhancement by Samsung comes amid tight HBM supply, surpassing... -
SK Hynix Poised to Dominate HBM4 Market with 70% Price Hike and $7B Global Investment for AI Acceleration
SK Hynix South Korea Overview SK Hynix, commanding over 60% of the high-bandwidth memory (HBM) market, projects a nearly 70% price increase for its next-generation HBM4, slated for 2026. To meet soaring AI demand, the company is committi... -
Samsung’s Aggressive HBM4 Investment Targets Top HBM Market Share Next Year, Attracting NVIDIA and AMD Interest
Sammy Fans South Korea Overview According to UBS forecasts, Samsung Electronics is poised to become the world's leading HBM memory manufacturer next year, driven by aggressive investments and expanded production in HBM4. The rapid surge ... -
Micron Initiates Mass Production of 36GB 12-Layer HBM4 for NVIDIA Vera Rubin, Boosts US Semiconductor Investment Over $250 Billion
openPR.com USA Overview Micron Technology commenced mass production of its advanced 36GB 12-layer HBM4 memory in March 2026, shipping to NVIDIA for its Vera Rubin platform. This move underscores the market's rapid shift towards higher-ca... -
TSMC Doubles Advanced Packaging Capacity Over Three Years; Samsung Expands 2nm & Advanced Packaging Collaboration with Broadcom
BigGo Finance Taiwan Overview TSMC revealed it has doubled its advanced packaging capacity annually for the past three years but still lags behind surging AI chip demand, operating 10 dedicated facilities globally. Meanwhile, Samsung Ele... -
Samsung Unveils zHBM, a 3D Logic-Memory Integrated AI Architecture, Alongside HBM4E/HBM5 Roadmap at FMS 2026
Samsung Semiconductor South Korea Overview Samsung presented its vision for next-generation AI infrastructure at FMS 2026, unveiling its HBM roadmap, including HBM4E and HBM5, and a novel 3D memory architecture called zHBM. This zHBM sol... -
JEDEC Relaxes HBM4 Package Height to 775 µm, Enabling 12-Hi/16-Hi Stacks Without Immediate Cu-Cu Hybrid Bonding
Exponential Industry USA Overview JEDEC has relaxed the HBM4 package height specification from 720 µm to 775 µm, allowing for 12-Hi and 16-Hi stack HBM modules without immediate reliance on Cu-Cu hybrid bonding. HBM utilizes 3D stacked D... -
QD-OLED Dominates 2026 OLED Monitor Market with Superior Color Gamut and HDR Performance
ROG Global Taiwan Overview In 2026, QD-OLED technology leads the OLED monitor market as the flagship choice, excelling in wide color gamut, high saturation, and vibrant HDR highlights. Combining blue OLED pixels with a quantum dot layer,...
