Samsung Electronics– tag –
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South Korea Unveils Major Investment Plan to Boost National Competitiveness in Advanced Packaging
Maeil Business Newspaper (MK.co.kr) South Korea Overview The South Korean government announced a large-scale investment plan to enhance national competitiveness in advanced packaging. This strategy aims to meet surging demand for AI and ... -
Advanced Semiconductor Packaging & Chiplet Show (ASPS) 2026 in Suwon, Korea, to Cover Advanced Packaging, Chiplets, and HBM
Advanced Semiconductor Packaging & Chiplet Show (ASPS) South Korea Overview The Advanced Semiconductor Packaging & Chiplet Show (ASPS) will take place from August 26-28, 2026, at the Suwon Convention Center in South Korea. This B2B e... -
CPO Shipments Intensify as Four Foundries Pursue Diverse Paths in Next-Gen Optical Integration
MLQ News Global Overview As Co-Packaged Optics (CPO) shipments scale up, four major semiconductor foundries—TSMC, Intel, Samsung Foundry, and GlobalFoundries—are pursuing distinct strategies for next-generation optical integration. TSMC ... -
Quantum Dot Displays Redefine Market Value with QD-OLED Image Quality and Microfluidics/3D Printing Manufacturing Advances
ReHack International Overview Quantum dot (QD) display technology is fundamentally redefining the value proposition of the screen technology market through superior color reproduction and energy efficiency. QD-OLED, in particular, achiev... -
CuspAI Secures $580M to Accelerate AI-Driven Materials Discovery Platform
AlleyWatch UK Overview Cambridge-based startup CuspAI has raised a substantial $580 million from investors including Temasek, Lightspeed Venture Partners, and Samsung Electronics. CuspAI's platform functions as a structured search engine... -
2.5D Packaging and HBM Integration Accelerate for AI Accelerators: TSMC CoWoS and Samsung I-CubeS Drive Towards 5.5x Reticle Sizes by 2026
Econ Market Research Global Overview The adoption of HBM-integrated 2.5D packaging for AI accelerators is rapidly expanding, with TSMC and Samsung spearheading the technological advancements. TSMC's CoWoS platform now supports silicon in... -
Biopharmaceuticals Contract Manufacturing Market Expands Amid Global Demand: CDMOs Scale Up Capacity
openPR.com Unknown Overview This article provides an overview of a market research report published by openPR.com. The biopharmaceutical contract manufacturing market is growing due to increased demand for biosimilars, expanded investmen... -
Samsung Display Leads QD Display Tech with $10.8B QD-OLED Production Shift and QNED Development
Wikipedia International Overview Quantum dot (QD) display technology is making remarkable progress, with QD-OLED leading the industry by combining blue emitters with red-green conversion layers for improved efficiency and color gamut. Sa... -
SK hynix Unveils $4 Billion Indiana HBM Plant, Bolstering U.S. Semiconductor Packaging and AI Supply Chains
Silicon Analysts USA Overview SK hynix has announced a significant $4 billion investment to establish an advanced High-Bandwidth Memory (HBM) packaging facility in Indiana, USA, with mass production slated for late 2028. This strategic m... -
Advanced Package Substrate Market Heats Up: Ibiden Leads with $3.2 Billion Investment, Samsung Electro-Mechanics Challenges with Glass Substrates, Technical Hurdles Emerge
MK Japan Overview The package substrate market, crucial for AI semiconductor performance, is intensifying with major investments and technological competition. Japan's Ibiden maintains dominant leadership with ~35% market share, investin...
