Samsung Electronics– tag –
-
HBM4 Competition Shifts to Cooling Technology Amid Hybrid Bonding Delays and Nvidia’s Next-Gen GPU Trends
DigiTimes Taiwan Overview Industry experts note that the focus of competition in the 6th-generation High-Bandwidth Memory (HBM4) market is shifting towards cooling technology, against the backdrop of delays in hybrid bonding adoption. HB... -
SK Hynix Reapproves 7.1 Trillion Won Investment for Cheongju P&T7, Significantly Bolstering Advanced Packaging Capacity for HBM and AI Memory
The Elec South Korea Overview SK Hynix has reapproved a 7.1 trillion won (approximately $5.5 billion) investment for its Cheongju P&T7 project, aiming to significantly bolster its advanced packaging capacity for AI memory products, i... -
South Korean Semiconductor Giants Samsung and SK Hynix Plan $518 Billion Mega-Investment to Double DRAM Production, Reshaping AI Chip Market
CoinDesk South Korea Overview South Korean semiconductor giants Samsung Electronics and SK Hynix have announced massive investment plans totaling approximately $518 billion (about 80 trillion JPY) over the next five years. This capital w... -
HBM Shortage Accelerates ‘Chipflation,’ TrendForce Forecasts New Normal Driven by Unabating AI Demand
The Korea Economic Daily South Korea Overview Surging AI infrastructure demand is driving up memory chip prices, straining cloud providers' profit margins. Market research firm TrendForce predicts that the HBM (High-Bandwidth Memory) sho... -
Samsung Delays Hybrid Bonding HBM Mass Production to 2029-2030, Aligning with Technical Challenges and NVIDIA’s Next-Gen GPUs
TrendForce South Korea Overview Samsung Electronics is reportedly delaying the full-scale mass production of its hybrid bonding technology for next-generation HBM and logic semiconductors until 2029-2030. The company is currently buildin... -
Samsung Biologics Acquires PolyPeptide in All-Cash Offer: Accelerating Multi-Modality Strategy and Global Network Expansion
PR Newswire South Korea Overview Samsung Biologics announced an all-cash offer to acquire PolyPeptide, accelerating its multi-modality strategy and expanding its global manufacturing network across the U.S., Europe, and India. This acqui... -
QD-OLED Quantum Dot Materials Market Enters Growth Phase with Samsung Display Shipping Over 5 Million Panels
SMR (Market Research Report) International Overview This article summarizes an SMR report on the global market for quantum dot film and on-chip materials for QD-OLEDs, which is projected for significant growth. The expansion is driven by... -
IMEC, TSMC, Intel, and Samsung Pursue Atomically-Thin 2D Transistors to Sustain Moore’s Law Beyond Silicon in 2026
Internet Pros USA Overview As silicon transistors approach scaling limits, industry leaders IMEC, TSMC, Intel, and Samsung are shifting to atomically-thin 2D semiconductors for next-generation chips. Materials like molybdenum disulfide (... -
SEMI Advanced Packaging Summit 2026 Highlights HBM and 2.xD Packaging as Key Innovators for AI/HPC Performance and Power Efficiency
SEMI USA Overview The SEMI Advanced Packaging Summit 2026, themed "Packaging the Future of AI – From Silicon to Photon," deeply explored the evolution and industrial implications of packaging technologies for the AI era. Discussions high... -
Samsung Electro-Mechanics Challenges Ibiden in AI Server Package Substrates with FC-BGA and Glass Substrate Push
MK South Korea Overview Samsung Electro-Mechanics is aggressively challenging Ibiden's dominant market share in AI package substrates by enhancing its Flip-Chip Ball Grid Array (FC-BGA) and next-generation glass substrate technologies fo...
