SiC– tag –
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Heraeus Electronics Unveils Advanced Die-Attach Materials for High-Reliability Power Electronics at PCIM Europe 2026
Heraeus Electronics Germany Overview Heraeus Electronics unveiled cutting-edge material technologies for power electronics at PCIM Europe 2026. New offerings include mAgic® PE340 silver pressure sintering paste for high-density packaging... -
CTE-Gradient Interconnect Technology Drastically Reduces Thermal Cycling Damage in SiC Inverters
PatSnap Eureka USA Overview PatSnap Eureka reveals an innovative approach to mitigate thermal cycling damage in SiC power inverter modules by creating biomimetic interconnects with a Coefficient of Thermal Expansion (CTE) gradient. This ... -
TANAKA to Unveil Advanced High-Conductivity Die-Attach Materials for Next-Gen Power Semiconductors at SEMICON Southeast Asia 2026
田中貴金属グループ Japan Overview TANAKA Precious Metals will showcase high-thermal-conductivity and high-reliability silver sintering pastes and AgSn TLP sheets for next-generation SiC and GaN semiconductors at SEMICON Southeast Asia 20... -
Direct Die-Attach Microchannel Cooling with Sintered Silver Boosts SiC Inverter Thermal Performance
PatSnap Eureka USA Overview An innovative thermal management solution combining direct die-attach microchannel cooling with sintered silver bonding is proposed to combat overheating in high-power-density SiC inverters. By directly joinin...
