SiC– tag –
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Momentive Performance Materials Expands High Thermal Conductivity Potting Compound Capacity to Meet Surging EV and Power Electronics Demand
Chemical Week USA Overview Momentive Performance Materials announced a significant expansion in its production capacity for high thermal conductivity potting compounds to address surging demand from EV battery packs and power electronics... -
New Silver Sinter Paste Revolutionizes Thermal Management for SiC Power Modules, Boosting EV and Renewables
Power Electronics Magazine Global Overview A new silver sinter paste with high thermal conductivity and excellent reliability has been unveiled for SiC (silicon carbide) power modules. This advanced bonding material significantly enhance... -
Sheen Technology Enhances EV Range and Safety through Advanced Battery Thermal Management
Sheen Technology China Overview Sheen Technology emphasizes that effective thermal management is crucial for extending EV battery range and recommends precise application of thermal pastes or greases. Applying thin, uniform gap filler la... -
Indium Corporation Unveils AuLTRA® 75 Gold-Based Die-Attach Preforms for 5G, Military, and Aerospace GaN Devices at IMS
Industrial Electronics USA Overview Indium Corporation announced it will feature its high-reliability, gold-based precision die-attach preforms at the International Microwave Symposium (IMS). A highlight is AuLTRA® 75, an off-eutectic Au... -
Comprehensive Review of SiC Power Module Packaging: Silver and Copper Sintering Key to Enhanced Thermal and Electrical Performance
IEEE Xplore Unknown Overview A comprehensive review paper analyzes the latest technologies in SiC power module packaging, focusing on layout, material systems, and integration. The review emphasizes how advanced die-attach techniques, in... -
PCIM Europe 2026 Unveils Innovations in Power Module Reliability and SiC/GaN Power Semiconductor Packaging Technologies
MacDermid Alpha, PCIM Europe Germany Overview PCIM Europe 2026 in Nuremberg, Germany, featured significant innovations in power module reliability and next-generation power semiconductor packaging. MacDermid Alpha unveiled underfills, hi... -
Sumitomo Bakelite Develops G785 Series High-Tg Epoxy Molding Compounds with Industry-Leading 230°C Tg for Next-Gen SiC Power Modules
Sumitomo Bakelite Co., Ltd. Japan Overview Sumitomo Bakelite has developed the 'G785 Series' of high-Tg epoxy molding compounds for next-generation SiC power modules, achieving an industry-leading glass transition temperature (Tg) of 230... -
Sn-Coated Cu Solder Paste via Transient Liquid Phase Bonding Offers High-Reliability for Power Device Packaging
MDPI Switzerland Overview This MDPI paper reports on the potential of Sn-coated Cu solder paste for power device packaging using Transient Liquid Phase Bonding (TLPB). While Cu offers excellent electrical and thermal conductivity, its ox... -
Talc’s Multifunctional Role: Enhancing Performance in EV Batteries and Power Electronics
Alliance Chemical USA Overview Talc plays a crucial role in advanced technologies from EV batteries to power electronics. Talc-filled silicone or polyurethane gap pads serve as thermal interface materials in EV battery modules, providing... -
Henkel Expert Reveals Material Innovations Critical for Power Electronics Reliability and Thermal Management
EE Times USA Overview Dr. Bruchak Conley from Henkel discussed the pivotal role of material evolution in power electronics, emphasizing that die attach encapsulants and thermal interface materials (TIMs) dictate module reliability under ...
