SiC– tag –
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Indium Corporation to Showcase Advanced Materials for AI at SEMICON Taiwan, Including High-Thermal-Conductivity Sintering Pastes and TIMs
Indium Corporation USA Overview Indium Corporation will exhibit innovative materials enabling AI technology at SEMICON Taiwan 2026, including Heterogeneous Integration and Assembly (HIA) products and groundbreaking Thermal Interface Mate... -
Caly Technologies Releases TIM Selection Guide for Power Electronics, Optimizing Thermal Management for SiC and GaN Devices
Alibaba Electronics China Overview Caly Technologies has published a Thermal Interface Material (TIM) selection guide for power electronics, aiding in optimizing thermal management for high-performance devices like SiC half-bridge module... -
Indium Corporation Showcases High Thermal Conductivity TIMs and Sintering Pastes for AI at SEMICON Taiwan
Indium Corporation USA Overview Indium Corporation exhibited innovative materials supporting AI technology at SEMICON Taiwan, highlighting Heat-Spring® compressible metal TIMs and solder TIMs for superior thermal conductivity in high-pow... -
Indium Corporation to Unveil High-Reliability Power Device Packaging Solutions, Including SiC and Cu Sintering Pastes, at PCIM Asia 2026
Indium Corporation USA Overview Indium Corporation will showcase its next-generation high-reliability packaging solutions for power electronics at PCIM Asia 2026. Key offerings include InFORCE®MF pressure silver sintering paste for SiC d... -
Indium Corporation Unleashes Low-Temperature Silver Sintering Paste to Propel GaN Power Device Evolution
Indium Corporation USA Overview Indium Corporation has launched a novel low-temperature silver sintering paste specifically designed for Gallium Nitride (GaN) power devices. This advanced material enables high-reliability die attachment ... -
Heraeus Unleashes Pressureless Silver Sintering Pastes to Propel High-Power SiC Modules in EV Inverters
Heraeus Electronics News Germany Overview Heraeus has introduced two advanced silver sintering pastes designed to revolutionize die attachment for high-power Silicon Carbide (SiC) modules, particularly within electric vehicle (EV) invert... -
New 230°C High-Heat-Resistant Epoxy Encapsulation Material (EME-G785 Series) Boosts SiC Power Module Applications and Thermal Performance
creating nano technologies inc. Japan Overview Creating Nano Technologies Inc. has introduced the EME-G785 series, a new epoxy encapsulation material with 230°C heat resistance, poised to expand applications for SiC power modules. This m... -
Bosch Secures $225M in U.S. Commerce Department Funding for $2 Billion SiC Semiconductor Fab Conversion in California, Boosting Domestic Production
Bosch Germany Overview Bosch has secured up to $225 million in direct funding from the U.S. Department of Commerce, part of a broader $2 billion investment to convert its Roseville, California facility into a silicon carbide (SiC) semico... -
New Low-Temperature Sintering Die Attach Material Revolutionizes IGBT Module Manufacturing for Enhanced Performance
Advanced Power Semiconductor Technology Global Overview A new low-temperature sintering die attach material for IGBT modules has been announced, offering high thermal conductivity and reliability while reducing stress on heat-sensitive c... -
Sumitomo Bakelite Unveils Advanced Encapsulation Materials for Automotive Power Semiconductors, Boosting EV/HEV Safety and Efficiency
Automotive Electronics World Japan Overview Sumitomo Bakelite has announced new advanced encapsulation materials designed to enhance the reliability of automotive power semiconductors for Electric Vehicles (EVs) and Hybrid Electric Vehic...
