Thermal Interface Material– tag –
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Henkel Expert Reveals Material Innovations Critical for Power Electronics Reliability and Thermal Management
EE Times USA Overview Dr. Bruchak Conley from Henkel discussed the pivotal role of material evolution in power electronics, emphasizing that die attach encapsulants and thermal interface materials (TIMs) dictate module reliability under ... -
Ziitek Technology Unveils Next-Gen Liquid Cooling Systems and Advanced Thermal Management Materials for Data Centers
Ziitek Technology China Overview Ziitek Technology announced it will showcase two decades of thermal innovation at the 2026 Global Data Center Liquid Cooling Exhibition, presenting full-stack thermal management solutions from advanced th... -
Direct Die-Attach Microchannel Cooling with Sintered Silver Boosts SiC Inverter Thermal Performance
PatSnap Eureka USA Overview An innovative thermal management solution combining direct die-attach microchannel cooling with sintered silver bonding is proposed to combat overheating in high-power-density SiC inverters. By directly joinin... -
Plexus Introduces Thermomechanical Polyurethane Adhesives for Integrated Thermal Management and Structural Bonding in EVs and Power Electronics
ITW Performance Polymers (Plexus) USA Overview Plexus has launched a new series of thermomechanical polyurethane structural adhesives, including the DT2630LD, designed to concurrently manage heat and provide robust structural bonding in ...
