Thermal Interface Material– tag –
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NovoLINC Unveils MaxLINC, Achieving Industry-Leading 0.7 mm²•K/W Thermal Resistance for Multi-Kilowatt AI Chips
PR Newswire (NovoLINC) Unknown Overview NovoLINC has launched MaxLINC, an advanced thermal interface material (TIM) designed for high-performance AI computing, achieving an industry-leading thermal resistance as low as 0.7 mm²•K/W. This ... -
Gel-Based Cooling Pad Market Poised for Growth Through 2035, Driven by Biopharma Cold Chain and EV Demand
IndexBox Global Overview The global gel-based cooling pads market is projected for substantial growth through 2035, primarily fueled by the expanding biopharma cold chain, consumer electronics, and electric vehicle (EV) battery pack appl... -
Henkel Unveils Low-Diisocyanate PUR Hot-Melt Adhesives and More at SICAM 2026 to Boost Furniture Production Efficiency
Henkel Germany Overview Henkel showcased new adhesive solutions at SICAM 2026 aimed at significantly improving efficiency in furniture production. Key innovations include the Technomelt PUR 260/x ME family of PUR hot-melt adhesives with ... -
Apple Unveils 2nm iPhone 18; Samsung Cuts Thermal Resistance by 16% with Encapsulant and TIM Innovations, Intensifying Competition with TSMC
BigGo Finance South Korea Overview Following Apple's announcement of the 2nm iPhone 18, Samsung Electronics and TSMC are intensifying their competition in next-generation semiconductor packaging and thermal management. Samsung has achiev... -
HakTak Lays Out Thermal Putty’s Critical Role in Optimizing EV Battery and Inverter Thermal Management
HakTak USA Overview HakTak underscores the indispensable role of thermal putty in optimizing thermal management for electric vehicle (EV) battery and inverter systems. As an ideal thermal interface material (TIM), thermal putty efficient... -
Indium Corporation to Showcase Advanced Materials for AI at SEMICON Taiwan, Including High-Thermal-Conductivity Sintering Pastes and TIMs
Indium Corporation USA Overview Indium Corporation will exhibit innovative materials enabling AI technology at SEMICON Taiwan 2026, including Heterogeneous Integration and Assembly (HIA) products and groundbreaking Thermal Interface Mate... -
CTX Thermal Solutions Expands TIM Portfolio with Thermal Pads, Graphite Foils for 5G, EV, and Medical Applications
SJN (Semiconductor Journal Network) USA Overview CTX Thermal Solutions has expanded its Thermal Interface Material (TIM) portfolio to enhance heat dissipation efficiency in electronic components, addressing thermal management challenges ... -
Automotive Industry Innovates Assembly Efficiency and Durability in 2026 with Structural Adhesives for Aluminum and Composites
B8X Germany Overview In 2026, the automotive industry is dramatically enhancing assembly efficiency and durability through high-performance structural adhesives optimized for aluminum and composite materials, driven by increasing adoptio... -
Smart High Tech Secures $10.5M from Henkel Ventures to Propel Graphene TIM Production for Next-Gen Electronics
Graphene-Info Israel Overview Smart High Tech (SHT) has secured $10.5 million from lead strategic investor Henkel Ventures, earmarked to significantly scale the production of its patented graphene-enhanced Thermal Interface Material (TIM... -
Caly Technologies Releases TIM Selection Guide for Power Electronics, Optimizing Thermal Management for SiC and GaN Devices
Alibaba Electronics China Overview Caly Technologies has published a Thermal Interface Material (TIM) selection guide for power electronics, aiding in optimizing thermal management for high-performance devices like SiC half-bridge module...
