Thermal Interface Material– tag –
-
Indium Corporation’s Jason Chou to Present “Material Solutions for AI Industry” at SEMICON Taiwan
Indium Corporation USA Overview Indium Corporation's Jason Chou will deliver a presentation titled "Material Solutions for AI Industry from Packaging to System Assembly" at SEMICON Taiwan, held from September 2-4, 2026. His talk will foc... -
Wevo Unveils WEVOSIL 26040 FL, a 4 W/m·K Silicone Gap Filler for High-Performance Thermal Management
Wevo Germany Overview Wevo has launched WEVOSIL 26040 FL, a new silicone gap filler thermal interface material (TIM) boasting a thermal conductivity of 4 W/m·K. Optimized for power electronics and battery technologies, this material feat... -
Indium Corporation Showcases High Thermal Conductivity TIMs and Sintering Pastes for AI at SEMICON Taiwan
Indium Corporation USA Overview Indium Corporation exhibited innovative materials supporting AI technology at SEMICON Taiwan, highlighting Heat-Spring® compressible metal TIMs and solder TIMs for superior thermal conductivity in high-pow... -
MDPI Review Compares Advanced Semiconductor Packaging: Spotlighting Thermal Management and Reliability Challenges
MDPI Switzerland Overview A review paper published in MDPI critically compares advanced packaging architectures, including 2D, 2.5D, and 3D integration, detailing challenges in thermal management, warpage from thermomechanical mismatch, ... -
H.B. Fuller Unveils EternaBond® Dry Technology System for RV Manufacturing: Dramatically Improving Watertightness and Production Speed
H.B. Fuller Blog USA Overview H.B. Fuller has launched its EternaBond® Dry Technology System (DTS) for RV manufacturing, which significantly enhances watertightness and production speed. This tape-form product replaces multi-step sealing... -
Kootai Chemicals Enhances EV Battery Thermal Management and Protection with Silicone Potting Compounds, Mitigating Thermal Runaway Risks
Facebook (Kootai Chemicals) China Overview Kootai Chemicals is offering advanced silicone potting compounds to strengthen thermal management and physical protection in EV battery packs. These low-viscosity materials uniformly fill air vo... -
DELO Introduces DUALBOND LT Series: Next-Gen Ultra-Low Temperature Curing Adhesives for Consumer Electronics, Curing at 45°C
SMT Today Germany Overview DELO has launched a new generation of super low temperature (SLT) curing adhesives, part of its DUALBOND LT family, specifically for consumer electronics assembly. These innovative adhesives achieve reliable bo... -
DuPont Unveils High-Performance, Silicone-Free Thermal Gap Filler for Next-Gen EV Battery Packs
DuPont Transportation & Industrial Press USA Overview DuPont has introduced an advanced silicone-free thermal gap filler material engineered to significantly improve thermal management in next-generation electric vehicle (EV) battery pac... -
Haktak Enhances Semiconductor Packaging Solutions for EV Batteries, Power Electronics, and AI Servers
Haktak Global Overview Haktak is reinforcing its comprehensive range of semiconductor and electronics assembly materials, crucial for the reliability of high-performance devices like EV batteries, power electronics, and AI servers. The c... -
Quantum-Inspired Algorithms Propel Semiconductor Materials Discovery: Resonac and QC Ware Achieve 28x Computational Acceleration
Resonac Japan Overview In a significant breakthrough for materials science, Resonac, partnering with QC Ware, has validated a next-generation computational chemistry technology that accelerates chemical reaction transition state calculat...
