Thermal Interface Material– tag –
-
TSMC Accelerates Backend Ecosystem Reorganization, Reshaping Semiconductor Competitive Landscape as Advanced Packaging Breaks Process Shrinkage Limits
The Economy Taiwan Overview Advanced packaging technology is rapidly emerging as a new competitive domain in the semiconductor industry, gaining importance as traditional process shrinkage approaches its technical limits. Packaging techn... -
Indium Corporation Expert to Present TIM Solutions for AI Thermal Challenges at IMAPS ThermCon, Focusing on Gold-Based Die Attach Preforms for High-Power Laser and RF Applications
Indium Corporation USA Overview Indium Corporation expert Ryan Mayberry will present research on Thermal Interface Material (TIM) solutions for AI thermal challenges at IMAPS ThermCon. The study focuses on advanced gold-based precision d... -
Amkor Technology to Unveil Advanced Power Module Packaging Technologies for the AI Era at SEMI Advanced Packaging Summit 2026
Amkor Technology South Korea Overview Amkor Technology will participate in the SEMI Advanced Packaging Summit 2026 on July 15, with Shinji Baba, Senior Vice President, presenting on "Advanced Power Module Packaging Technologies." The pre... -
Future of HBM Hinges on Cooling Innovations: TSVs, High-Conductivity Underfills, and Hybrid Bonding for HBM5+ Are Key
AI Strategies by Kim Joung-Ho South Korea Overview The future of High Bandwidth Memory (HBM) and High Bandwidth Flash (HBF) critically depends on cooling innovations to manage extreme thermal densities. Key advancements include Through-S... -
Samsung Boosts AI Performance in Galaxy S26/S26+ with Redesigned Vapor Chamber and Customized TIMs
Samsung AU Australia Overview Samsung has equipped its new Galaxy S26 and S26+ smartphones with an advanced thermal management system to maintain peak AI performance. This includes a redesigned vapor chamber and customized Thermal Interf... -
Panasonic Industry Europe Offers Thermal Interface Materials and Semiconductor Device Materials as Part of Expanded Electronic Materials Portfolio
Panasonic Industry Europe GmbH Germany Overview Panasonic Industry Europe is supplying advanced Thermal Interface Materials (TIMs) and semiconductor device materials within its electronic materials product portfolio. These materials are ... -
Ring PCB Details Advanced Thermal Management for High-Power PCBAs: Strict TIM Application, Customized Thick Copper Reflow, and High-Density Thermal Via Arrays
Ring PCB China Overview Ring PCB provides solutions for ensuring thermal stability in high-power Printed Circuit Board Assembly (PCBA) systems through rigorous application of Thermal Interface Materials (TIMs), customized reflow temperat... -
Cutter Electronics Unveils New Thermal Interface Materials (TIMs) for LED and Heatsink Applications
Cutter Electronics Australia Overview Cutter Electronics has announced new thermal interface materials (TIMs), including thermal pads and compounds, essential for efficient thermal management in LEDs and heatsinks. These new products are... -
Henkel Unveils Low-Viscosity Technomelt PA 6370 Hot Melt Adhesive for Precision Small-Gap Protection in Electronic Assemblies
Adhesives/Sealants.org (Henkel) Germany Overview Henkel has introduced Technomelt PA 6370, a new polyamide-based, low-viscosity hot melt adhesive specifically developed for sealing narrow gaps and intricate electronic components. This in... -
New Thermal Interface Materials Address High Heat Flux Challenges in AI Servers, Ensuring Data Center Stability
Data Center Dynamics Global Overview New Thermal Interface Materials (TIMs) have been announced to address the high heat flux challenges stemming from the rapid advancement of AI servers. These TIMs maximize heat transfer efficiency betw...
