Thermal Interface Material– tag –
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IndexBox Report: EV Battery Bio-Renewable Thermal Films Market to Grow Until 2035, Driven by Thermal Runaway Prevention and Sustainability Goals
IndexBox International Overview This article summarizes a market research report published by IndexBox, forecasting significant growth for the EV Battery Bio-Renewable Thermal Films Market through 2035. Key drivers include increasing dem... -
Plasma Surface Engineering for Automotive Thermal Management Maximizes TIM Wettability to Minimize Thermal Resistance
KeyLink USA Overview Advanced plasma surface treatment has been introduced to significantly reduce contact thermal resistance in EV powertrain cooling systems. This technology elevates substrate surface energy to over 72 mN/m, achieving ... -
Alliance Chemical Report: Advanced Talc Applications Crucial for EV Battery Thermal Management and Power Electronics Reliability
Alliance Chemical USA Overview An Alliance Chemical report highlights that engineered talc grades are becoming critical in high-tech manufacturing, including EV battery thermal management and power electronics. In epoxy molding compounds... -
Henkel Adhesives Innovates Advanced Semiconductor Packaging Materials for High-Performance Computing and Generative AI
Henkel Adhesives Germany Overview Henkel is developing innovative material solutions for advanced semiconductor packaging, addressing demands for higher performance, greater integration, and improved efficiency in a rapidly evolving tech... -
SemiMedia Reports China Accelerating Global Catch-Up in Advanced Packaging Materials for AI and HPC
SemiMedia China Overview A SemiMedia report indicates that China is accelerating its global catch-up in advanced packaging materials, driven by the demand for AI chips and high-performance computing (HPC). The focus is on developing high... -
PatSnap Eureka Report: Optimizing Adhesive Coverage to Reduce Cell Delamination Risks in Advanced Packaging and Flexible Displays
PatSnap Eureka Global Overview A PatSnap Eureka report highlights the critical need for improved adhesive technologies and optimized coverage to prevent cell delamination in advanced semiconductor packaging and flexible display sectors. ... -
QinanX New Material Offers Fast-Curing, High-Clarity, Low-Shrinkage UV-Curable Adhesives for Electronics, Optics, and Medical Industries
QinanX New Material China Overview QinanX New Material provides UV-curable adhesives that cure in seconds under UV light for a wide range of applications, including electronics, optical lenses, displays, medical devices, and glass/plasti... -
Arkema Unveils Next-Gen Material Solutions for EV Batteries at Battery Show Europe 2026, Enhancing Adhesion, Energy Density, and Recyclability
Arkema France Overview Arkema showcased integrated material solutions for EV and energy storage system battery packs at The Battery Show Europe 2026, focusing on improved adhesion, energy density, safety, and recyclability. Key innovatio... -
Dow Launches DOWSIL TC-3120 Thermal Gel with 12 W/m·K Conductivity for AI Networking and 800G/1.6T Optical Modules
Lightwave USA Overview Dow has introduced DOWSIL TC-3120 Thermal Gel, a new silicone-based thermal interface material (TIM) designed for high-speed networking equipment, optical modules, and other electronics facing intense thermal-manag... -
Samsung and Intel Pioneer Low-Warpage Solutions for Advanced Electronics Packaging, Boosting Reliability
PatSnap Eureka Global Overview Samsung and Intel are spearheading efforts to reduce warpage in electronics packaging components. Samsung leverages its I-Cube technology and optimized package stack designs to match thermal expansion chara...
