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Laser Debonding Technology Becomes Critical for Improving Thin Wafer Yield in HBM and Hybrid Bonding
Microtreat Global Overview Laser debonding is gaining importance as the cleanest and least damaging wafer separation technology for high-value 3D integration and advanced packaging. For ultra-thin wafers (20-50 micrometers) in HBM, chipl... -
Samsung Dedicates Half of Its 4nm Foundry Capacity to HBM4 Base Dies Amid AI Boom
ZDNet Korea South Korea Overview Samsung Electronics is reportedly allocating over 50% of its advanced 4nm foundry capacity—specifically 15,000 wafers per month out of an estimated 30,000 total—to the production of HBM4 base dies. This s... -
Micron Reportedly Targets Doubling HBM Capacity to 100,000 Wafers/Month by End-2026, Boosting 12-High HBM4 for NVIDIA Vera Rubin
digitimes USA Overview Micron is reportedly targeting a near-doubling of its High Bandwidth Memory (HBM) production capacity to approximately 100,000 wafers per month by the end of 2026. This significant expansion focuses on ramping up p... -
AI Supply Chain Maxed Out: 40-Week Lead Times Become New Normal as HBM Emerges as Primary Bottleneck Over TSMC CoWoS
Markets Insider USA Overview The AI supply chain faces severe constraints, with 40-week lead times becoming the new norm. High Bandwidth Memory (HBM) has replaced TSMC's CoWoS advanced packaging as the primary bottleneck, driven by NVIDI... -
TSMC CoWoS Capacity Expands 9X in 3 Years, Yet 10% AI Chip Shortage Persists with NVIDIA Securing 60%
XenoSpectrum Taiwan Overview TSMC's CoWoS advanced packaging capacity has surged nine-fold over three years, but a 10% supply shortage for AI chips remains due to soaring demand. NVIDIA currently secures approximately 60% of TSMC's CoWoS... -
HBM Supply Crunch: Long Backlogs for Bonding Equipment and Low Yields Create Bottleneck, Constraining AI Demand Until 2027
AI CERTs News USA Overview HBM stack manufacturing demands Through Silicon Vias (TSV) and high-precision bonding equipment, with low yield tolerance posing an industry challenge. Limited vendors for these specialized tools mean HANMI, a ... -
Bonafide Research: Global 3D/2.5D IC Packaging Market Accelerates with UCIe Standard, Forecasts Growth Through 2031
Bonafide Research India Overview This article provides an overview of a market research report published by Bonafide Research. According to Bonafide Research's latest report, the global 3D IC and 2.5D IC packaging market is projected to ... -
HBM Supply Crisis of 2026 Projected to Persist Until 2027, Redefining AI Hardware Deployment Bottleneck
EnkiAI USA Overview Explosive growth in the AI sector has triggered a structural HBM supply crisis, making it the primary bottleneck for AI hardware deployment throughout 2026, projected to last until at least 2027. The market has shifte... -
Samsung HBM4 Yield Dramatically Improves from Under 60% to 80%; SK Hynix Labor Talks Stall, Intensifying AI Memory Race
TrendForce Taiwan Overview Samsung's HBM4 yield has dramatically improved from under 60% at launch to 80% within months, according to Seoul Economic Daily. This swift process enhancement by Samsung comes amid tight HBM supply, surpassing... -
SK Hynix Poised to Dominate HBM4 Market with 70% Price Hike and $7B Global Investment for AI Acceleration
SK Hynix South Korea Overview SK Hynix, commanding over 60% of the high-bandwidth memory (HBM) market, projects a nearly 70% price increase for its next-generation HBM4, slated for 2026. To meet soaring AI demand, the company is committi...
