September 2026– date –
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Applied Materials Launches New HBM & 3D Packaging Systems, Acquires ASMPT NEXX to Scale AI Compute
Exoswan Insights USA Overview Applied Materials has introduced new CMP, ECD, deposition, and e-beam systems for HBM and 3D packaging, alongside acquiring ASMPT's NEXX business, to capitalize on the escalating demand for AI computing. The... -
AI Inference and China’s Strategic Investments Ignite Semiconductor Manufacturing Boom, Propelling Silicon Wafer Recovery
Electronic Device Industry News Japan Overview The semiconductor manufacturing equipment and materials market is experiencing an unexpected boom, fueled by surging demand for inference AI and significant renewed investment from China. Ev... -
AI Boom Spurs China’s Top OSATs to Pour Billions into Advanced Packaging
Digital Today China Overview China's three leading OSAT firms—JCET, Tongfu Microelectronics, and Huatian Technology—have reported significant profit surges in H1 2026, largely due to escalating AI semiconductor demand. In response, these... -
Powertech Aims for Early 2027 Launch of World’s First AI Server Panel-Level Packaging Mass Production
Tonarism Taiwan Overview Powertech Technology, a leading Taiwanese OSAT, has unveiled plans to commence mass production of panel-level packaging (PLP) for AI semiconductors and server CPUs by early 2027. This initiative establishes the w... -
Scientech Forecasts 50% Shipment Growth Driven by AI Demand, Targets Next-Gen CoPoS Market Entry
Taipei Times Taiwan Overview Scientech, a Taiwanese supplier of advanced packaging equipment and reclaimed wafers, anticipates a 50% year-over-year increase in shipments this year, fueled by robust AI application demand and rapid technol... -
TSMC Establishes Kaohsiung Advanced Packaging Cluster, Aims for Up to 50% Efficiency Gains
digitimes Taiwan Overview TSMC announced the establishment of an advanced packaging materials and equipment supply chain cluster in Kaohsiung's Baipu Industrial Park, Taiwan. This strategic move aims to enhance efficiency in advanced pac... -
Taiwan and Lithuania Ink €5.6M Tech Pact to Develop Advanced Packaging Machinery for Next-Gen Chips
Taiwan News Taiwan Overview Taiwan and Lithuania have signed an MOU to jointly develop advanced packaging machinery for next-generation chips, committing €5.6 million (approx. $6.5 million USD) over two years in a public-private partners... -
Taiwan’s OSATs Boost AI Capacity with $14.4B Capex; ASE Deepens TSMC CoWoS Collaboration to Meet Soaring Demand
Domino Theory Taiwan Overview Five leading Taiwanese chip packaging and test companies plan a record $14.4 billion (NT$460 billion) in capital expenditures this year to meet surging AI chip demand, matching TSMC's own advanced packaging ... -
TSMC CoWoS Capacity Expands 9X in 3 Years, Yet 10% AI Chip Shortage Persists with NVIDIA Securing 60%
XenoSpectrum Taiwan Overview TSMC's CoWoS advanced packaging capacity has surged nine-fold over three years, but a 10% supply shortage for AI chips remains due to soaring demand. NVIDIA currently secures approximately 60% of TSMC's CoWoS... -
AI-Designed Drug Makes Human Debut: BigHat Biosciences Begins Clinical Trial for Gastric Cancer ADC
BigHat Biosciences USA Overview BigHat Biosciences has initiated a Phase 1 clinical trial for BHB810, a novel CDH17-targeted VHH-Fc antibody-drug conjugate (ADC) designed using its AI-powered antibody design platform. Developed for gastr...
