November 2026– date –
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Business Trends
Henkel: AI Chip Adhesive Production and 2027 R&D Roadmap
The Korea Herald South Korea Overview Henkel is leveraging its Songdo, South Korea facility to produce advanced semiconductor adhesives required for AI chip packaging. The company plans to expand its research capabilities with a new tech... -
Market Trends
Epoxy Degradation Analysis: PCA-Based Spectral Mapping of 3 Curing Agents
Bioengineer.org USA Overview Researchers utilized principal component analysis (PCA) to link the complex spectral fingerprints of degrading filler-containing epoxy adhesives to the loss of mechanical strength. The study reveals that degr... -
New Technology
Plasma Surface Activation: Argon vs Nitrogen for Plastic Bonding
Bioengineer.org Overview Nitrogen and argon atmospheric-pressure plasma significantly increase the lap-shear strength of engineering plastics, with nitrogen boosting PVC and PP adhesion by up to six-fold. However, research indicates that... -
New Technology
Boron Nitride Composites: Tuning Heat Flow via MSLA 3D Printing
Bioengineer.org USA Overview Researchers have demonstrated that masked stereolithography (MSLA) 3D printing can control the orientation of hexagonal boron nitride (h-BN) platelets to tune thermal conductivity. By adjusting platelet size ... -
New Technology
Nano-silver Sintering: Reliability on Cyanate Ester Composites
Research Square Overview Low-temperature nano-silver sintering enables the direct bonding of power chips to fiber-reinforced cyanate ester composite substrates with a maximum shear strength of 11.5 MPa. The joints maintain 9.3 MPa streng... -
New Technology
Porous Heat Shield Simulation: 3D Ablation Interface Tracking
Bioengineer.org Overview Researchers have developed a hybrid micro-continuum scale modeling approach to track 3D ablation interfaces in carbon fibrous preform porous media. The simulation reproduces experimentally observed recession patt... -
New Technology
Starlink V3: SpaceX’s 1Tbps Satellite Specs and Orbit Roadmap
Impress Watch Japan Overview SpaceX has deployed the first 26 Starlink V3 satellites via Starship Flight 14, featuring a massive increase in capacity to 1Tbps per satellite. By combining larger hardware with lower orbital altitudes, Spac... -
New Technology
ESA Celeste: LEO-PNT End-to-End Validation and IOD1 Specs
Inside GNSS USA Overview The European Space Agency's Celeste program has successfully demonstrated end-to-end LEO-PNT capabilities via the IOD1 satellite, with signals tracked and decoded by ground receivers. The validation confirms that... -
New Technology
H3 Rocket Flight 10: MMX Launch Success and 80% Reliability
Mynavi News Japan Overview JAXA and Mitsubishi Heavy Industries (MHI) successfully launched the H3 rocket's 10th flight on October 20, 2026, deploying the Martian Moons eXploration (MMX) probe. This milestone increases the H3's overall s... -
New Technology
Satellite Surface Charging: AI-Based Detection via CNN and 19-Year Dataset
sorae Japan Overview Researchers from Kyushu Institute of Technology and JAXA developed a world-first AI method using Convolutional Neural Networks (CNN) to automatically detect surface charging on satellites. By analyzing 19 years of da...