November 2026– date –
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MOF-808-NaCu Catalyst: Methanol Synthesis for Mars ISRU 2026
XenoSpectrum China Overview Researchers from the Deep Space Exploration Laboratory have developed a dual-active site catalyst, MOF-808-NaCu, that increases methanol synthesis from CO2 by approximately 11.1 times compared to a copper-only... -
Space Mobility: Lunar Road System and “Mechanical Gravity” Roadmap
PR Newswire USA Overview Space Mobility has developed a lunar road system using in-situ resource utilization (ISRU) to increase rover driving capability from 25% to 99% of Earth levels. By utilizing "Mechanical Gravity" via interlocking ... -
NTT and JAXA LEO Satellite MIMO: 3×3 Capacity Gains and Specs
BigGo Finance Japan Overview NTT and JAXA have successfully demonstrated in-orbit MIMO communication using the "LEOMI" device on the Small Demonstration Satellite-4, achieving a 2.67x increase in transmission capacity with a 3x3 configur... -
Microchip PIC64-HPSC: RISC-V Spaceflight Computing Milestones
Electronics Media USA Overview Microchip has achieved key development milestones for its PIC64-HPSC 64-bit multicore RISC-V computing platform, including successful radiation characterization. The platform is designed to enable high-perf... -
ZBLAN Glass Fibre: ISS Microgravity Impact on Strength and Loss
Electronics For You UK Overview An ISS experiment produced 11.8km of ZBLAN glass fibre, with space-drawn step-index fibres showing 80 per cent higher median ultimate tensile strength than Earth-made equivalents. The results demonstrate t... -
Lam and imec: 3D Integration and High-NA EUV Roadmap for AI
Electronics Weekly UK Overview Lam Research and imec are collaborating to accelerate the transition of 3D integration and advanced patterning technologies from the lab to high-volume manufacturing. The partnership focuses on solving proc... -
Hunan Titan Future: China’s First 12-Inch Polycrystalline SiC Substrate
TrendForce News China Overview Hunan Titan Future Technology has developed China's first 12-inch polycrystalline silicon carbide (SiC) substrate featuring thermal conductivity exceeding 280 W/(m·K). Designed for AI computing chips and ad... -
Glass Substrate Packaging: 510x515mm Size and Warpage Constraints
21ic China Overview Panel-level glass substrates are shifting toward a 510x515mm standard to increase area utilization from 45-65% to over 81% compared to 300mm wafers. However, scaling is limited by a "warpage wall" where warpage displa... -
Photosensitive Crystallizable Glass: KICET’s TGV Process for Semiconductors
Financial News (파이낸셜뉴스) South Korea Overview The Korea Institute of Ceramic Technology (KICET) has developed a photosensitive crystallizable glass material to enable the domestic production of next-generation semiconductor substrat... -
GIST Glass Substrates: Low-Dielectric Material for AI Chips
Money Today (mt.co.kr) South Korea Overview Researchers at the Gwangju Institute of Science and Technology (GIST) have developed a low-dielectric aluminoborosilicate glass material to replace polymer-based organic substrates in AI semico...
