Key Findings
Sumitomo Bakelite Co., Ltd. is increasing its production capacity for encapsulation materials used in advanced semiconductor packages. The company will install new production lines for SUMIKON™ EME molded underfill (MUF) materials and compression-molding granules at its manufacturing sites in Singapore and Suzhou, China.
Technical Details
The expansion targets two specific material categories designed for high-density packaging:
- SUMIKON™ EME Molded Underfill (MUF): These materials are engineered for low-warpage characteristics and high filling performance in microscopic gaps. The MUF process allows for the filling of solder joints and the encapsulation of the entire package within a single molding process, increasing both manufacturing efficiency and reliability.
- Compression-Molding Granules: These granules are optimized for narrow-gap filling through the precise control of resin viscosity, filler size, and particle-size distribution. This technical configuration enables uniform molding and low warpage, even when applied to large panels.
Background and Context
The decision to expand capacity is driven by a rapid increase in demand for advanced semiconductors in China and Southeast Asia. This growth is primarily linked to the development of communications satellites and generative AI. Simultaneously, the industry is seeing a trend toward semiconductor packages that are increasingly large, thin, and dense, necessitating materials that can maintain structural integrity and precision.
Significance and Outlook
By expanding its footprint in Suzhou and Singapore, Sumitomo Bakelite intends to respond more reliably and promptly to the evolving requirements of advanced semiconductor manufacturing. The deployment of these specific MUF and compression-molding technologies aims to improve overall productivity for manufacturers dealing with the complexities of next-generation, high-density semiconductor packaging.
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