New Technology– category –
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DELO Introduces DUALBOND LT Series: Next-Gen Ultra-Low Temperature Curing Adhesives for Consumer Electronics, Curing at 45°C
SMT Today Germany Overview DELO has launched a new generation of super low temperature (SLT) curing adhesives, part of its DUALBOND LT family, specifically for consumer electronics assembly. These innovative adhesives achieve reliable bo... -
Panacol Unveils Next-Gen UV Adhesives for Medical Devices, Elevating Biocompatibility and Sterilization Resistance
Panacol-Elosol GmbH News Germany Overview Panacol has launched a new series of UV-curable adhesives specifically engineered for medical device assembly, boasting significantly enhanced biocompatibility and robust sterilization resistance... -
Ajinomoto Fine-Techno’s ABF Breakthrough Powers Next-Gen AI: Enhanced Dielectrics and Reduced CTE Critical for Advanced Packaging
Ajinomoto Fine-Techno Investor Relations Japan Overview Ajinomoto Fine-Techno has announced a significant evolution of its Ajinomoto Build-up Film (ABF) technology, specifically engineered to meet the rigorous packaging demands of next-g... -
3M Launches Fast-Curing Acrylic Adhesive for Multi-Material Bonding to Lightweight EV Body Structures
3M（3M Automotive Solutions News） USA Overview 3M has announced a new high-strength acrylic adhesive formulated for multi-material bonding in electric vehicle (EV) body structures. This adhesive enables reliable joining of dissimilar ma... -
Wacker Unveils Advanced Silicone Encapsulant for Automotive Power Modules, Promising Unprecedented Durability and Safety for EVs
Wacker Chemie AG Press Release Germany Overview Wacker has introduced an innovative silicone encapsulant designed specifically for automotive power modules, offering superior protection against moisture, vibration, and extreme temperatur... -
Indium Corporation Unleashes Low-Temperature Silver Sintering Paste to Propel GaN Power Device Evolution
Indium Corporation USA Overview Indium Corporation has launched a novel low-temperature silver sintering paste specifically designed for Gallium Nitride (GaN) power devices. This advanced material enables high-reliability die attachment ... -
Sumitomo Bakelite Unveils Novel Low-Stress Epoxy Compound for Next-Gen 2.5D/3D Packaging
SEMI Europe Conference News Japan Overview Sumitomo Bakelite has announced a groundbreaking epoxy molding compound (EMC) at SEMI Europe, specifically engineered for the intricate demands of 2.5D and 3D advanced packaging solutions. This ... -
DELO’s Breakthrough UV Adhesive Optimizes LiDAR Performance for Autonomous Vehicles
DELO Industrial Adhesives Press Release Germany Overview DELO has introduced a novel high-precision, UV-curable adhesive designed to revolutionize the assembly of advanced LiDAR sensors for autonomous vehicles. This innovative material f... -
Fraunhofer IPA Engineers a ‘Smart’ Adhesive to Revolutionize Automotive Recycling
Fraunhofer IPA Research Highlights Germany Overview Researchers at Fraunhofer IPA have developed a groundbreaking epoxy-based debondable structural adhesive for automotive applications. This innovation allows for the clean, on-demand dis... -
DuPont Unveils High-Performance, Silicone-Free Thermal Gap Filler for Next-Gen EV Battery Packs
DuPont Transportation & Industrial Press USA Overview DuPont has introduced an advanced silicone-free thermal gap filler material engineered to significantly improve thermal management in next-generation electric vehicle (EV) battery pac...
