New Technology– category –
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Artemis II Crew Honored with Congressional Space Medal of Honor After Historic Lunar Flyby Return
NASA / SoCo Digest USA Overview The Artemis II crew—NASA astronauts Reid Wiseman, Victor Glover, Christina Koch, and CSA astronaut Jeremy Hansen—has successfully returned to Johnson Space Center following their historic lunar flyby missi... -
NASA Begins RS-25 Engine Integration for Artemis III SLS Rocket, Crew Training Advances for Lunar Mission
NASA USA Overview NASA has commenced the critical RS-25 engine installation onto the Space Launch System (SLS) rocket core stage for the upcoming Artemis III crewed lunar mission, marking significant hardware progress. Concurrently, the ... -
Amkor Technology and NVIDIA Announce $1.5 Billion Advanced Packaging Partnership to Accelerate AI Multi-Die Integration
IMAPS 3D InCites Content Platform USA Overview Amkor Technology and NVIDIA announced a multi-year partnership in July 2026, including a $1.5 billion advanced packaging and development agreement, to drive next-generation technology for AI... -
TRUMPF Resolves Glass Substrate TGV Coating Bottleneck with High-Power HiPIMS, Accelerating Next-Gen AI Chip Packaging
TRUMPF Germany Overview TRUMPF has introduced a High-Power Impulse Magnetron Sputtering (HiPIMS) approach to address a key manufacturing challenge in next-generation AI chip packaging: reliably coating millions of minute Through-Glass Vi... -
Glass Substrates Emerge as Key Breakthrough for Next-Gen AI Chip Packaging: Intel, TSMC, Samsung Accelerate Development
Industry Analyst International Overview Glass substrates are increasingly recognized as a critical breakthrough for next-generation AI chip packaging, with industry leaders like Intel, TSMC, and Samsung Electro-Mechanics accelerating the... -
Applied Materials Launches New HBM & 3D Packaging Systems, Acquires ASMPT NEXX to Scale AI Compute
Exoswan Insights USA Overview Applied Materials has introduced new CMP, ECD, deposition, and e-beam systems for HBM and 3D packaging, alongside acquiring ASMPT's NEXX business, to capitalize on the escalating demand for AI computing. The... -
Powertech Aims for Early 2027 Launch of World’s First AI Server Panel-Level Packaging Mass Production
Tonarism Taiwan Overview Powertech Technology, a leading Taiwanese OSAT, has unveiled plans to commence mass production of panel-level packaging (PLP) for AI semiconductors and server CPUs by early 2027. This initiative establishes the w... -
TSMC Establishes Kaohsiung Advanced Packaging Cluster, Aims for Up to 50% Efficiency Gains
digitimes Taiwan Overview TSMC announced the establishment of an advanced packaging materials and equipment supply chain cluster in Kaohsiung's Baipu Industrial Park, Taiwan. This strategic move aims to enhance efficiency in advanced pac... -
AI-Designed Drug Makes Human Debut: BigHat Biosciences Begins Clinical Trial for Gastric Cancer ADC
BigHat Biosciences USA Overview BigHat Biosciences has initiated a Phase 1 clinical trial for BHB810, a novel CDH17-targeted VHH-Fc antibody-drug conjugate (ADC) designed using its AI-powered antibody design platform. Developed for gastr... -
Protein Accumulation Mechanism is Key to PROTAC Efficacy, Unlocking New Strategies for Refractory Cancers
News-Medical UK Overview Researchers have discovered that the mechanism by which cancer-driving proteins accumulate within tumors significantly influences the efficacy of PROTAC drugs. The study demonstrated that PROTACs are more effecti...
