Applied Materials– tag –
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BESI Hybrid Bonding System Orders Exceed 150 Units, HBM5 Onward to Accelerate Memory Adoption
PhotonCap Unknown Overview BESI has secured over 150 cumulative orders for its hybrid bonding systems, with six integrated production lines (including 30 BESI bonders) implemented by major logic customers in partnership with Applied Mate... -
Applied Materials Forecasts Over 70% Growth in Advanced Packaging Revenue, Total Revenue Up 40%, Driven by AI and HBM Demand
TradingKey USA Overview Applied Materials projects approximately 40% growth in its total revenue for 2026, benefiting significantly from the increasing complexity in AI chip and HBM manufacturing. The company anticipates over 70% growth ... -
Self-Healing Polymer Coating for Aerospace Applications Activated by UV and Heat Extends Airframe Fatigue Life, Cuts Maintenance Costs
ACS Applied Materials & Interfaces International Overview Researchers have developed an innovative self-healing polymer coating for aerospace applications that autonomously repairs minor damage. Activated by specific stimuli like UV ligh... -
KLA’s Advanced Packaging Business Set for $1.1 Billion Revenue, 70%+ Growth Driven by AI Demand and Yield Bottleneck Resolution
Quartz USA Overview KLA is significantly benefiting from accelerating demand for advanced packaging inspection, metrology, and process control tools due to the increasing complexity of AI/HPC chips and hybrid bonding advancements. Its ad... -
Applied Materials Launches New HBM & 3D Packaging Systems, Acquires ASMPT NEXX to Scale AI Compute
Exoswan Insights USA Overview Applied Materials has introduced new CMP, ECD, deposition, and e-beam systems for HBM and 3D packaging, alongside acquiring ASMPT's NEXX business, to capitalize on the escalating demand for AI computing. The... -
Applied Materials Unveils New Hybrid Bonding Platform for High-Volume 3D Stacked Chip Manufacturing, Enabling Ultra-Fine Pitch Integration
Business Wire USA Overview Applied Materials has launched a new hybrid bonding platform designed for high-volume manufacturing of next-generation 3D stacked chips. This innovative system achieves high-precision alignment and high through... -
Applied Materials Achieves Record Q3 2026 Revenue Driven by Unprecedented AI-Fueled Demand for Materials Engineering Solutions
Applied Materials (News Release) USA Overview Applied Materials reported record revenue in Q3 2026, driven by soaring demand for materials engineering solutions fueled by rapid global AI adoption. The company announced three new EPIC Cen... -
Semiconductor Inspection Equipment Market to Reach $13.4 Billion by 2034, KLA Leads in Advanced Packaging Process Control
Exponential Industry USA Overview The semiconductor inspection equipment market is projected to grow at a 7.9% CAGR from 2026 to 2034, reaching $13.4 billion, driven by increasing AI chip complexity and advanced packaging adoption. KLA i... -
Applied Materials Raises Advanced Packaging Revenue Forecast to Over 70% Growth on AI Demand, Unveils New HBM Systems
TrendForce USA Overview Applied Materials has significantly revised its advanced packaging revenue forecast for 2026 to over 70% year-over-year growth, a 20-percentage-point increase in just three months, driven by soaring AI semiconduct... -
Applied Materials Achieves Record $9.12 Billion Revenue in Q3 2026, Driven by Surging AI Demand
Applied Materials, Inc. USA Overview Applied Materials announced record-breaking revenue of $9.12 billion in the third quarter of 2026, significantly propelled by the rapid proliferation of AI and the ensuing strong demand for its materi...
