Chip– tag –
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Ajinomoto’s Critical Chip Film, ABF, Faces Supply Test as Escalating AI Demand Mounts Pressure for Price Hikes
digitimes Taiwan Overview Global AI chip demand is putting new pressure on the supply of Ajinomoto Build-up Film (ABF), a key material for advanced semiconductor packaging. Ajinomoto faces increasing pressure to raise ABF prices, making ... -
Ajinomoto’s ABF Price Stability Strategy Amid Surging AI Demand Prompts Investor Re-evaluation of Portfolio Focus
Simply Wall St News Japan Overview Despite record financial results and robust demand for AI-related Ajinomoto Build-up Film (ABF), Ajinomoto Corporation plans to maintain ABF prices and expand production capacity through 2032. This stra... -
Resonac CEO Navigates Soaring AI Chip Demand and China Supply Chain Risks, Bolstered by Key Patent Ruling
Crypto Briefing Japan Overview The CEO of Resonac Holdings, a key supplier of non-conductive film for HBM chips and liquid encapsulants for 2.5D semiconductor packages, emphasized strategies for managing surging AI chip demand while miti... -
Resonac Secures Key Patent on Liquid Encapsulant for 2.5D AI Chips, Bolstering Reliability and Market Position
IBTimes JP Japan Overview Resonac announced that the Japan Patent Office has upheld the validity of its patent (Patent No. 7687499) for a liquid encapsulant used in 2.5D semiconductor packages for generative AI. This ruling validates the... -
Semiconductor Engineering Report Highlights AI-Driven Optical-Logic Integration and Hybrid Bonding for Increased Interconnect Density
Semiconductor Engineering USA Overview A June 2026 Semiconductor Engineering report emphasizes that AI systems are driving a closer integration of optics and logic, necessitating co-evolution in fabrication, packaging, thermal management... -
Ajinomoto to Secure ABF Supply Capacity for AI Chip Demand Until 2030, Prioritizing Production Expansion Over Price Hikes
GIGAZINE Japan Overview Ajinomoto announced its capability to meet the surging demand for Ajinomoto Build-Up Film (ABF), a critical interlayer dielectric for advanced semiconductor packaging, until 2030, driven by the exponential growth ... -
Resonac’s Liquid Encapsulant Patent Upheld for 2.5D AI Semiconductor Packages, Ensuring Enhanced Reliability
Resonac Japan Overview Resonac announced that the Japan Patent Office upheld the validity of its Japanese patent (No. 7687499) for a liquid encapsulant critical for 2.5D semiconductor packages in generative AI applications. This technolo... -
AI Theme Propels Nikkei 225, Driving Significant Gains for Advanced Packaging Material Companies like Resonac and Mitsui Kinzoku
IG Japan Overview The latest Nikkei 225 analysis highlights the significant impact of the AI theme on the market, showing substantial gains for chemical manufacturers like Resonac, a global leader in advanced packaging materials and epox... -
ECTC 2026: Intel Foundry and Amkor Announce Advanced Packaging Technologies for AI/HPC and U.S. Manufacturing Capacity Expansion
Intel Newsroom, Amkor Technology Blog, Semiconductor Engineering USA Overview The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased advanced packaging technologies redefining scalability limits for AI and high-pe... -
Mastering 3D-IC Verification Complexity: Multiphysics Analysis Key to Addressing Thermal, Mechanical Stress, and Reliability Challenges
Semiconductor Engineering USA Overview As the semiconductor industry transitions from 2D to 2.5D and 3D-IC configurations, verification complexity is escalating significantly. This article emphasizes the necessity of multiphysics analysi...
