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Malaysian Consortium Initiates Pilot Line Development for High Bandwidth Memory (HBM) Advanced Packaging, with NSW Automation Providing Precision Adhesive Dispensing
The Star Malaysia Overview The Malaysia Advanced Packaging Consortium (MAPC) has launched an initiative to develop advanced packaging technologies and a pilot line for High Bandwidth Memory (HBM4) chips. NSW Automation plays a key role, ... -
Dow Unveils TC-3120 High-Performance Thermal Gel for Data Centers: High Thermal Conductivity and Excellent Flowability to Address AI and Big Data Challenges
Assembtek USA Overview Dow has launched TC-3120, a high-performance thermal gel specifically engineered for thermal management in data center chips, servers, and high-speed optical modules (400G/800G). This thermal gel features exception... -
TrendForce Reports Samsung Files New HBM Dummy Die Patent to Enhance 16-Layer HBM5 Stack Reliability
TrendForce Taiwan Overview TrendForce reports that Samsung has filed a new HBM dummy die patent aimed at enhancing 16-layer HBM5 stack reliability. This patent seeks to address warpage and heat dissipation issues in high-stack configurat... -
SK Hynix’s Advanced MR-MUF Packaging Process Reduces HBM4 Thermal Resistance by 17%, Contributing to AI Accelerator Chip Stabilization
Kynix China Overview SK Hynix's Advanced MR-MUF (Mass Reflow Molded Underfill) packaging process has been shown to reduce HBM4 thermal resistance by 17% compared to conventional HBM4. This innovative technology is crucial for maintaining... -
Samsung Announces HBM4E Hybrid Copper Bonding Reduces Package Height by Over 15% While Improving Thermal Characteristics
Sammy Fans South Korea Overview Samsung has presented research on its HBM4E packaging strategy, emphasizing that Hybrid Copper Bonding (HCB), which eliminates underfill materials, offers superior thermal properties compared to convention... -
Ajinomoto Fine-Techno Presents Advancements in ABF Film for AI Semiconductor Packaging, Supporting High-Performance Evolution
SEMI Global News Japan Overview Ajinomoto Fine-Techno has announced its latest advancements in ABF (Ajinomoto Build-up Film) technology for AI semiconductor packaging, contributing to higher performance and reliability in AI processors. ... -
New Low-Temperature Sintering Die Attach Material Revolutionizes IGBT Module Manufacturing for Enhanced Performance
Advanced Power Semiconductor Technology Global Overview A new low-temperature sintering die attach material for IGBT modules has been announced, offering high thermal conductivity and reliability while reducing stress on heat-sensitive c... -
Low Warpage Mold Compound Solutions Highlighted at IEEE ECTC 2026 Address 2.5D/3D Packaging Challenges
Advanced Packaging World (ECTC 2026 Post-Conference Review) Global Overview At the IEEE ECTC (Electronic Components and Technology Conference) 2026 post-conference review, multiple low warpage molding compound solutions addressing warpag... -
New Underfill Material Enables High-Performance Chiplet Integration in Fan-Out Wafer-Level Packaging
Semiconductor Packaging News Global Overview A new underfill material designed for Fan-Out Wafer-Level Packaging (FOWLP) has been developed, enabling next-generation high-performance chiplet integration. This material combines excellent ... -
Heraeus Announces New Pressureless Sintering Paste for High-Power GaN Devices, Balancing Cost and Performance
Semiconductor Today Germany Overview Heraeus has announced an innovative pressureless sintering paste specifically for high-power GaN (gallium nitride) devices. This material achieves high bonding strength and excellent thermal conductiv...
