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Sumitomo Bakelite Unveils Advanced Encapsulation Materials for Automotive Power Semiconductors, Boosting EV/HEV Safety and Efficiency
Automotive Electronics World Japan Overview Sumitomo Bakelite has announced new advanced encapsulation materials designed to enhance the reliability of automotive power semiconductors for Electric Vehicles (EVs) and Hybrid Electric Vehic... -
New Silver Sinter Paste Revolutionizes Thermal Management for SiC Power Modules, Boosting EV and Renewables
Power Electronics Magazine Global Overview A new silver sinter paste with high thermal conductivity and excellent reliability has been unveiled for SiC (silicon carbide) power modules. This advanced bonding material significantly enhance... -
Novel Low-CTE Epoxy Molding Compound Developed to Tackle Warpage in Large AI Semiconductors
Journal of Materials Science & Technology Global Overview Researchers have developed a novel low-coefficient of thermal expansion (CTE) epoxy molding compound specifically for encapsulating large dies such as HBM and AI semiconductors. T... -
Henkel Unveils High-Performance Underfill Material for Advanced Logic and Memory Packaging, Boosting Production Efficiency
Advanced Packaging Journal Germany Overview Henkel has introduced a new high-performance underfill material designed for advanced logic and memory packaging technologies like flip-chip and chiplets. This material significantly improves d... -
Zhengzhou Kerton Chemical Highlights Broad Applications of Epoxy Adhesives for High Performance and Reliability Across Industries
Zhengzhou Kerton Chemical Co., Ltd China Overview Zhengzhou Kerton Chemical Co., Ltd. emphasized the critical role of epoxy adhesives across diverse sectors including automotive, aerospace, electronics, construction, and new energy. For ... -
Hoenle Adhesives Launches High-Reliability Underfill ‘Structalit® 8205’ for Miniaturized, High-Density Electronic Assemblies
Adhesives & Sealants Industry (ASI) Germany Overview Hoenle Adhesives has introduced Structalit® 8205, an underfill designed for modern, miniaturized, and high-density electronic assemblies, offering exceptional mechanical stability, the... -
Henkel Offers Liquid Compression Molding (LCM) Solutions for Wafer-Level and Panel-Level Packaging
Henkel Adhesives Germany Overview Henkel provides encapsulation materials that enable advanced semiconductor packaging technologies where ICs are molded directly on wafers or panels prior to subsequent processing, using Liquid Compressio... -
Henkel Delivers Advanced Semiconductor Packaging Materials to Tackle Thermal and Mechanical Challenges in 2.5D/3D Packaging
Henkel Adhesives Germany Overview Henkel offers a diverse portfolio of advanced semiconductor packaging solutions, including lid and stiffener adhesives, EMI shielding, liquid compression molding solutions, and underfills. These material... -
On-Chip Photonics Manufacturing Bottleneck: Key Lies in Improving Adhesive and Encapsulant Thermal and Mechanical Stress Resistance
Semiconductor Engineering USA Overview On-chip photonics, while promising faster, lower-power data transmission, faces significant manufacturing infrastructure challenges. Specifically, the material stack—including carrier wafers, tempor... -
Resonac’s 2016 Liquid Encapsulant Patent for 2.5D AI Semiconductors Skyrockets in Strategic Value Amid Generative AI Boom
YouTube (3-Min Semi with Tai) Japan Overview Resonac's patent for liquid encapsulants, filed in 2016 for AI semiconductor applications, has dramatically increased in strategic importance with the current generative AI boom. This technolo...
