Chip– tag –
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ACS Nano Reports Isotropically Ultrahigh Thermal Conductive Boron Nitride/Polymer Composites, Revolutionizing AI Chip Cooling
ACS Nano USA Overview A breakthrough study published in ACS Nano presents a boron nitride (BN)/polymer composite with a biaxially oriented thermal conductive network, achieving isotropically ultrahigh thermal conductivity for advanced el... -
Exponential Relationship Between Underfill Adhesive Curing and Shear Strength Unveiled for Flip-Chip Micro-interconnections
springerprofessional.de Germany Overview A new study systematically investigated epoxy-based underfill adhesives in flip-chip packaging, establishing an exponential relationship between the degree of curing and shear strength. Researcher... -
Sheen Technology Details Evolving TIM Requirements for AI Chips, Emphasizing High Thermal Conductivity and Low Thermal Resistance for Liquid Cooling
Sheen Technology Taiwan Overview Sheen Technology has published a comprehensive guide outlining the evolving requirements for Thermal Interface Materials (TIMs) in high-performance AI chips. Driven by advanced packaging such as 2.5D/3D s... -
SK Hynix to Launch Advanced Packaging Plant in Indiana, USA by H2 2028 to Meet Surging HBM3 Demand
BigGo Finance South Korea Overview SK hynix is driving aggressive capacity expansion to meet the surging demand for High Bandwidth Memory 3 (HBM3). The company plans to begin operations at an advanced packaging plant in Indiana, USA, by ... -
Lenovo Legion Y70 2026 Gaming Phone Boosts Cooling with 12 W/mK Liquid Metal and High-Conductivity Gel
Cashkr China Overview The Lenovo Legion Y70 2026 gaming phone features a significantly enhanced cooling system, combining a 5,500 mm² vapor chamber with 12 W/mK liquid metal thermal conductivity and high thermal conductive gel. This setu... -
Wafer-Level Packaging: Scaling to $28 Billion by 2035 Amidst Miniaturization Demands
Market Research Unknown Overview A new market research report forecasts the Wafer Level Packaging (WLP) market to surge from $11.97 billion in 2026 to $28.81 billion by 2035. This substantial growth is primarily driven by the relentless ... -
SEMI Advanced Packaging Summit 2026 Highlights HBM and 2.xD Packaging as Key Innovators for AI/HPC Performance and Power Efficiency
SEMI USA Overview The SEMI Advanced Packaging Summit 2026, themed "Packaging the Future of AI – From Silicon to Photon," deeply explored the evolution and industrial implications of packaging technologies for the AI era. Discussions high... -
AI and EVs Drive 2026 Semiconductor Market, High-Bandwidth Memory (HBM) and Advanced Manufacturing Nodes Emerge as Key Growth Themes
Kraken USA Overview The 2026 semiconductor industry is experiencing significant growth, propelled by the rapid expansion of AI infrastructure, continued data center augmentation, and automotive electrification. Key growth themes include ... -
AI Fuels “Golden Age” of Advanced Packaging: Amkor-TSMC 10-Year CoWoS Deal Strengthens U.S. Supply Chain, ASE Builds 6 New Fabs Globally
TechNews Taiwan Overview 2026 marks the "golden age" of advanced packaging, with AI-driven demand prompting massive investment expansions from global packaging and test manufacturers. Amkor secured a 10-year long-term cooperation agreeme... -
TSMC Commits Additional $100 Billion to U.S. Semiconductor Manufacturing and Packaging, Bringing Total Investment to $265 Billion for 12 Facilities
NIST - National Institute of Standards and Technology USA Overview TSMC has announced an additional $100 billion investment in advanced semiconductor manufacturing and packaging facilities in the U.S., as part of a historic trade and inv...
