Chip– tag –
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UC Berkeley Joins Applied Materials’ EPIC Center to Accelerate Chip Innovation, Focusing on Advanced Packaging and Materials R&D
Stock Titan USA Overview UC Berkeley is partnering with Applied Materials' EPIC Center to accelerate chip innovation through enhanced R&D collaboration and talent development. This partnership will concentrate on advancing semiconduc... -
Lam Research to Invest Over $3 Billion in Global Lab Expansion, Accelerating Advanced Packaging for AI Era
Lam Research USA Overview Lam Research announced plans to invest over $3 billion in expanding its global lab network to significantly increase innovation velocity for the AI era. This substantial investment is aimed at accelerating produ... -
Innox Advanced Materials Surpasses Previous Year’s SpaceX Revenue in Seven Months, Diversifies into AI Semiconductor and EV Battery Materials
BigGo Finance South Korea Overview Innox Advanced Materials, a Korean company, achieved a significant supply expansion to SpaceX, with cumulative revenue in the first seven months of 2026 surpassing the previous year's total. Beyond aero... -
Haktak Enhances Semiconductor Packaging Solutions for EV Batteries, Power Electronics, and AI Servers
Haktak Global Overview Haktak is reinforcing its comprehensive range of semiconductor and electronics assembly materials, crucial for the reliability of high-performance devices like EV batteries, power electronics, and AI servers. The c... -
Applied Materials Unveils Material Engineering Systems for Next-Gen AI Chips Featuring Advanced 3D Architectures
YouTube (Applied Materials channel) USA Overview Applied Materials has introduced a new suite of chipmaking systems designed to enable advanced 3D chip architectures for next-generation AI. The company is facilitating this transition thr... -
Intel Foundry Leverages U.S. Advanced Packaging (Foveros, EMIB) to Power Next-Gen AI Semiconductors
Intel Newsroom USA Overview Intel Foundry is accelerating the realization of next-generation AI semiconductors through its advanced packaging technologies developed in U.S. facilities. Utilizing Foveros stacking, EMIB silicon bridges, an... -
Qnity Electronics Accelerates AI-Centric Advanced Packaging R&D with Expanded imec Collaboration
Converge Digest Belgium Overview Qnity Electronics has significantly expanded its strategic collaboration with imec, a world leader in nanoelectronics, to bolster long-term R&D in advanced semiconductor packaging crucial for AI and h... -
GlobalFoundries Secures $300 Million CHIPS Act Award to Accelerate U.S. Silicon Photonics Leadership for AI Optical Interconnect Demand
Vermont Business Magazine USA Overview GlobalFoundries has signed a $300 million award under the U.S. CHIPS and Science Act, aimed at accelerating the nation's silicon photonics leadership. This substantial investment will support innova... -
Aeluma Secures $30 Million US CHIPS Act Funding to Advance Scalable Non-InP Semiconductor Manufacturing Platform for Photonics
Semiconductor Today USA Overview Aeluma Inc. has signed a Letter of Intent to receive up to $30 million in funding under the U.S. CHIPS and Science Act. This capital will support the research and development of a scalable non-indium phos... -
Dexerials Achieves 7-Year Global Market Leadership for ACF, ARF, and SVR Display Products, Crucial for AI and Autonomous Driving Advancements
Dexerials Japan Overview Dexerials announced its Anisotropic Conductive Film (ACF), Anti-reflection film (ARF), and Optical elastic resin (SVR) have maintained top global market share for seven consecutive years. ACF is essential for IC ...
