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Advanced Die Attach Solder Paste for High-Power Packaging: Achieving >60-70 W/m·K Thermal Conductivity and Precision Filling
Global SMT & Packaging Global Overview A Global SMT & Packaging article emphasizes the critical role of die attach solder paste in high-power packaging, achieving excellent thermal conductivity of 60-70 W/m·K (and >70 W/m·K with C... -
Tom’s Hardware Reports: TSMC Achieves 6-Micron Hybrid Bonding, Full HBM Integration Potentially Delayed to HBM4E/HBM5 (2027-Late 2020s)
Tom's Hardware USA Overview Tom's Hardware reports on the 2026 status of hybrid bonding, revealing TSMC's SoIC achieves 3.5D integration by combining hybrid-bonded stacks with CoWoS modules on silicon interposers, reaching 6-micron preci... -
P Equity Research Analyzes Advanced Semiconductor Packaging: Illuminating the Roles of Underfill and Mold in 2.5D and CoWoS Architectures
P Equity Research Global Overview A P Equity Research article delves into advanced semiconductor packaging, including 2.5D and CoWoS architectures, detailing the crucial role of adhesives and encapsulants when processors and memory layer... -
Master Bond Offers High-Strength, High-Reliability Die Attach Epoxy Adhesives for Microelectronics
Master Bond USA Overview Master Bond provides die attach epoxy adhesives for microelectronic semiconductor packaging and chip-on-board assemblies, featuring high bond strength, thermal cycling resistance, mechanical shock/vibration resis... -
Master Bond Offers Epoxy Underfill Formulations to Boost Reliability for Flip-Chip and CSP Assemblies
Master Bond USA Overview Master Bond provides epoxy underfill formulations designed to significantly enhance the long-term reliability of flip-chip and chip-scale packaging (CSP) assemblies. These materials achieve excellent adhesion to ... -
Henkel Unveils Loctite ABLESTIK CDF900 Series Conductive Die Attach Film with >8 W/m-K Thermal Conductivity for AI and HPC Packages
SpecialChem Germany Overview Henkel Adhesive Technologies has introduced the new Loctite ABLESTIK CDF900 series conductive die attach film (cDAF), revolutionizing advanced packaging for AI accelerators and HPC processors. This innovative... -
Krayden Delivers Advanced Material Solutions for Flip Chip BGA to Enhance Interconnect Density, Thermal Paths, Warpage Control, and Reliability
Krayden USA Overview Krayden provides comprehensive material solutions addressing critical challenges in Flip Chip Ball Grid Array (FCBGA) packages, including interconnect density, thermal path design, package warpage, and long-term reli... -
Indium Corporation Showcases High Thermal Conductivity TIMs and Sintering Pastes for AI at SEMICON Taiwan
Indium Corporation USA Overview Indium Corporation exhibited innovative materials supporting AI technology at SEMICON Taiwan, highlighting Heat-Spring® compressible metal TIMs and solder TIMs for superior thermal conductivity in high-pow... -
MDPI Review Compares Advanced Semiconductor Packaging: Spotlighting Thermal Management and Reliability Challenges
MDPI Switzerland Overview A review paper published in MDPI critically compares advanced packaging architectures, including 2D, 2.5D, and 3D integration, detailing challenges in thermal management, warpage from thermomechanical mismatch, ... -
AI Technology Unveils Enhanced Thermal Dissipation Molding Underfill for HBM and 3D DRAM to Boost Package Reliability
AI Technology, Inc. USA Overview AI Technology, Inc. (AIT) has announced a new Molding Underfill (MUF) with significantly enhanced thermal dissipation, targeting advanced semiconductor packaging like HBM, 3D DRAM, and AI processors. This...
