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SK Hynix Breakthrough: Mass Reflow Underfill Molding Overcomes HBM Stacking Thermal Challenges, While Micron’s Hybrid Bonding Slashes Power Consumption by 30%
CSIS USA Overview SK Hynix has established a lead in HBM chip stacking by investing heavily in 'Mass Reflow Underfill Molding' (MR-MUF), a novel packaging technique that resolves the thermal and physical constraints of multi-die HBM stac... -
Taiyo Holdings and imec Achieve 700nm RDL Formation for Advanced Packaging, Accelerating AI and HPC Chip Performance
ChemAnalyst Japan Overview Taiyo Holdings, in collaboration with imec, announced the successful formation of 700nm Redistribution Layers (RDL) for advanced packaging using their next-generation FPIM series materials. This breakthrough is... -
AZoM Explains Polyimides’ Indispensable Role in Semiconductor Packaging, Critical for HBM and Chiplet RDLs
AZoM UK Overview AZoM has detailed the indispensable, multifunctional role of polyimides in semiconductor packaging, simultaneously providing insulation, adhesion, pattern definition, and stress control at the thin-film interface between... -
Apple Unveils 2nm iPhone 18; Samsung Cuts Thermal Resistance by 16% with Encapsulant and TIM Innovations, Intensifying Competition with TSMC
BigGo Finance South Korea Overview Following Apple's announcement of the 2nm iPhone 18, Samsung Electronics and TSMC are intensifying their competition in next-generation semiconductor packaging and thermal management. Samsung has achiev... -
Indium Corporation to Showcase Advanced Materials for AI at SEMICON Taiwan, Including High-Thermal-Conductivity Sintering Pastes and TIMs
Indium Corporation USA Overview Indium Corporation will exhibit innovative materials enabling AI technology at SEMICON Taiwan 2026, including Heterogeneous Integration and Assembly (HIA) products and groundbreaking Thermal Interface Mate... -
Indium Corporation’s Jason Chou to Present “Material Solutions for AI Industry” at SEMICON Taiwan
Indium Corporation USA Overview Indium Corporation's Jason Chou will deliver a presentation titled "Material Solutions for AI Industry from Packaging to System Assembly" at SEMICON Taiwan, held from September 2-4, 2026. His talk will foc... -
Krayden Offers Low-Stress Green Epoxy Molding Compound LINQSOL EMC-7535 for High-Voltage, High-Power Semiconductors
Krayden USA Overview Krayden is offering LINQSOL EMC-7535, a green epoxy molding compound (EMC) engineered for high-voltage and high-power semiconductor devices. This material features low modulus for reduced stress, a high glass transit... -
TSMC’s CoWoS Drives AI Semiconductor Demand, Japanese Material Suppliers Expand Ecosystem in Taiwan
The Economy Taiwan Overview TSMC's CoWoS advanced packaging technology is a primary driver for demand in AI accelerators and HBM, leading Japanese material suppliers like Namics (underfill) and Fujifilm (CMP slurry) to expand operations ... -
3M Supplies 5590H Thermally Conductive Acrylic Interface Pad for IC Chips and EV Batteries
Facebook (3M) USA Overview 3M is supplying its 5590H Thermally Conductive Acrylic Interface Pad, designed to provide an efficient heat transfer path between high-heat-generating components like IC chips and EV batteries, and their respec... -
Moldex3D Compression Molding Simulation Achieves Semiconductor Package Defect Prediction and Quality Enhancement
Rheologist gaze & solutions (Moldex3D) Taiwan Overview Moldex3D provides CAE simulation tools for compression molding processes in advanced semiconductor packaging, enabling precise simulation of how encapsulating materials like epoxy mo...
