CoWoS– tag –
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TSMC to Boost CoWoS Capacity Tenfold to 130K Wafers/Month by Late 2026, Accelerates Glass-Substrate CoPoS for AI Chips
Tom's Hardware USA Overview TSMC is aggressively expanding its advanced packaging capacity, projecting a tenfold increase in CoWoS production to over 130,000 wafers per month by the end of 2026 to meet surging AI demand. Despite this, de... -
Intel Commits to Massive Advanced Packaging Push for Foundry Revival, EMIB Capacity Expansion Key
BusinessKorea USA Overview Intel is committing to a massive expansion of its advanced semiconductor packaging capabilities to accelerate its foundry business revival, with a core focus on expanding its proprietary EMIB (Embedded Multi-di... -
TSMC CoWoS Capacity Becomes Major AI Chip Growth Bottleneck: Ramping to 120K Wafers/Month by late 2026 Still Falls Short of Demand
backplane Taiwan Overview TSMC's CoWoS packaging capacity is identified as the most critical bottleneck hindering AI chip evolution. While TSMC plans to quadruple its CoWoS production capacity from approximately 35,000 wafers/month in la... -
KLA’s Advanced Packaging Business Soars, Projecting Over $1.3B Revenue in FY2026 Driven by AI Inspection Demand
Bitget USA Overview KLA Corporation, a global leader in semiconductor process control and yield management, is experiencing rapid growth in its advanced packaging business, driven by the increasing complexity of AI chips. Revenue from th... -
ASMPT Establishes Advanced Packaging Technology Advisory Council to Accelerate AI-Era Innovation
ASMPT Singapore Overview ASMPT has established an Advanced Packaging Technology Advisory Council (TAC) to address the growing importance of advanced packaging for next-generation computing and AI components. The TAC will focus on a broad... -
NVIDIA CEO Jensen Huang Projects $150 Billion Annual Investment in Taiwan’s AI Supply Chain
BigGo Finance Taiwan Overview NVIDIA CEO Jensen Huang announced that the company's annual procurement and investment in Taiwan's AI supply chain is projected to reach $150 billion in the future, a tenfold increase from $10-$15 billion fo... -
NVIDIA’s CoWoS Bottleneck Eases, HBM Supply Emerges as Primary Constraint for AI Accelerators
24/7 Wall St. USA Overview TSMC's CoWoS advanced packaging capacity for AI accelerators is expanding, projected to reach 35,000 wafers/month by late 2026 and up to 140,000 wafers/month by 2027, alleviating a long-standing bottleneck. How... -
TSMC Repurposes Mature Node Capacity to CoWoS for AI Accelerators Amid Critical Supply Shortage
Tom's Hardware Taiwan Overview TSMC is reallocating 40-90nm mature node capacity to expand its CoWoS advanced packaging and silicon interposer fabrication, directly addressing a critical supply bottleneck for AI accelerators. This strate... -
ASMPT Establishes Technical Advisory Council to Accelerate AI-Era Innovation in Advanced Packaging
ASMPT Singapore Overview ASMPT announced on May 28, 2026, the formation of a Technical Advisory Council (TAC) to accelerate innovation in the AI era. The TAC will provide strategic guidance on advanced packaging roadmaps, including HBM a... -
AI Factory Power Draw Reshapes Grid Calculus: Direct Liquid Cooling Becomes Essential as Demand Soars
Computer Weekly UK Overview The exponential growth of AI factories is pushing data center power consumption to unprecedented levels, posing critical challenges for existing electrical grids. High-density AI processing via GPUs now mandat...
