CoWoS– tag –
-
Custom AI ASIC Landscape in May 2026: Broadcom, Google TPUs, Meta MTIA Face CoWoS Bottleneck
Tom's Hardware USA Overview As of May 2026, major tech players like Google (TPU), Meta (MTIA), and Broadcom (XDSiP platform) are actively developing custom AI ASICs to challenge NVIDIA's dominance and optimize specialized AI workloads. H... -
ASE Technology Boosts Advanced Packaging Investment to Record $8.5 Billion Amid Surging AI Demand
digitimes Taiwan Overview ASE Technology Holding, the world's largest chip packaging and test company, has significantly raised its 2026 capital expenditure to a record $8.5 billion, driven by surging demand for AI chips. The company pro... -
TSMC Accelerates CoWoS and SoIC Expansion to Quell AI Chip Bottleneck, Targets 4x Capacity by 2026
FinancialContent - Stock Market Taiwan Overview TSMC is aggressively expanding its CoWoS and SoIC advanced packaging capacity to address the soaring demand for AI chips, aiming to increase monthly wafer output from approximately 35,000 u... -
JSR Fortifies Advanced Semiconductor Material Production and R&D in Taiwan to Meet Surging AI Demand
JSR株式会社 Japan Overview JSR, a leading semiconductor materials manufacturer, announced a significant expansion of its production and R&D capabilities in Taiwan, effective April 2026. This strategic move, driven by key customer req... -
TSMC Forges Exclusive CoPoS Supply Chain to Secure Next-Gen AI Packaging Dominance
専門メディア Taiwan Overview TSMC is reportedly implementing a highly exclusive supply chain strategy for CoPoS, its next-generation panel-level packaging technology, to solidify its leadership in AI semiconductors. This move, involving ... -
TSMC’s CoWoS Bottleneck Threatens to Delay Google TPU Mass Production to 2027
専門メディア Taiwan Overview Chronic shortages in TSMC's CoWoS advanced packaging capacity are projected to delay mass production of Google's custom AI chips (TPU) until 2027. Despite TSMC's aggressive expansion plans targeting 120,000 w... -
TSMC Accelerates Advanced Packaging Capacity Expansion to Meet Exploding AI Demand
専門メディア Taiwan Overview TSMC is rapidly scaling its advanced CoWoS and SoIC packaging capacity to address the surging demand for AI chips. With 18 new fabs and advanced packaging facilities under construction globally, this expansio... -
TSMC Forecasts $1.5 Trillion Semiconductor Revenue by 2030, Introduces Optoelectronic COUPE Technology for AI
Taipei Times Taiwan Overview TSMC projects global semiconductor revenue to reach $1.5 trillion by 2030, driven by surging AI demand. The company plans to release its Compact Universal Photonic Engine (COUPE) technology this year, integra...
