DRAM– tag –
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SK Hynix Holds U.S. Talks on HBM Supply and Investment Plans, Bolstering Domestic Semiconductor Supply Chain
digitimes Taiwan Overview SK Hynix reportedly held private discussions with U.S. Deputy Assistant Secretary Alison Hooker regarding high-bandwidth memory (HBM) supply to key U.S. tech firms and potential semiconductor investment plans in... -
SK Hynix Begins Shipping 12-Layer Next-Gen ‘HBM4E’ Samples for AI, Delivering Significant Performance and Power Efficiency Gains Amidst NVIDIA CEO’s Endorsement
SK hynix Inc. South Korea Overview SK Hynix has commenced shipping samples of its 12-layer 'HBM4E,' a next-generation DRAM for AI, to key customers. This HBM4E features data processing speeds of up to 16Gbps per pin and over 20% improved... -
Advanced Packaging’s Evolution: 2.5D/3D Integration, Chiplets, and Hybrid Bonding Propel AI and HPC
Springer Professional Germany Overview Semiconductor packaging technology has dramatically evolved from 2D to 2.5D and 3D IC integration, a transformation accelerated by the explosive demand from AI and High-Performance Computing (HPC). ... -
Samsung to Establish Gwangju Advanced Packaging Facility, Eyes Full HBM Hybrid Bonding Transition by 2029
TrendForce South Korea Overview Samsung Electronics is reportedly considering a new advanced semiconductor packaging plant in Gwangju, South Korea, with investment plans potentially announced by June 2026. This strategic facility will fo... -
SK Hynix Boosts HBM4 Production with Major TC Bonder Order from Hanmi Semiconductor
The Korea Herald South Korea Overview SK Hynix has made a significant investment, ordering ₩44.2 billion (approx. $28.7 million USD) worth of advanced 'TC Bonder 4.5 Griffin' thermo-compression bonders from Hanmi Semiconductor. This stra... -
SK Group Chairman Deepens AI Alliances with Nvidia and TSMC, Expanding Next-Gen HBM and Advanced Packaging Collaboration
The Korea Herald South Korea Overview SK Group Chairman Chey Tae-won has strengthened alliances with leading AI chipmakers, meeting with Nvidia CEO Jensen Huang and later with TSMC Chairman C.C. Wei in Taiwan. Discussions focused on expa... -
Samsung Electronics to Invest $1.5 Billion in Vietnam Semiconductor Test Facility Amid Surging AI Chip Demand
Quintile Reports South Korea Overview Samsung Electronics announced plans to invest approximately $1.5 billion in a semiconductor testing facility in Vietnam to address the memory chip shortage caused by surging AI chip demand. This stra... -
NVIDIA’s CoWoS Bottleneck Eases, HBM Supply Emerges as Primary Constraint for AI Accelerators
24/7 Wall St. USA Overview TSMC's CoWoS advanced packaging capacity for AI accelerators is expanding, projected to reach 35,000 wafers/month by late 2026 and up to 140,000 wafers/month by 2027, alleviating a long-standing bottleneck. How... -
Samsung Electronics Pioneers HBM4 Mass Production with Hybrid Bonding, Solidifying Market Lead
専門メディア South Korea Overview Samsung Electronics is strategically deploying dedicated hybrid bonding lines in its domestic facilities for HBM4, aiming to secure market leadership. The company has successfully commenced mass producti... -
Hanmi Semiconductor Unveils Second-Gen Hybrid Bonder for Advanced HBM Stacking, Investing $67M in New Factory
専門メディア South Korea Overview Hanmi Semiconductor is set to introduce its second-generation hybrid bonder prototype this year, crucial for next-generation HBM mass production with over 20 stacked layers. Concurrently, the company is ...
