Epoxy– tag –
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Advanced Packaging Warpage Mitigation: Research Advances in Incorporating Negative Coefficient of Thermal Expansion Materials into Epoxy Molding Compounds and Underfills
Semiconductor Engineering USA Overview Active research is progressing on utilizing negative coefficient of thermal expansion (CTE) materials in epoxy molding compounds (EMC) and underfills to effectively mitigate warpage in large semicon... -
NIST and UCSD Develop Predictive Modeling for Cure Behavior and Thermal Endurance of Advanced Packaging Epoxy Underfills
Semiconductor Engineering USA Overview Researchers from the National Institute of Standards and Technology (NIST) and the University of California San Diego (UCSD) have published a technical paper detailing a new modeling technique to ac... -
Novel Hyperbranched Polyphenylsiloxane-Modified Epoxy Resin Achieves Dielectric Constant of 2.82 and Dissipation Factor of 0.02050 at 100 MHz for Electronic Packaging
ACS Publications USA Overview A new facile method has been reported for constructing hyperbranched polyphenylsiloxane (HBPSi)-modified epoxy resins with excellent low dielectric properties for electronic packaging. The developed DGEBA/HB... -
Epoxy-Based Debonding-on-Demand Adhesives to Dominate EV Battery Module Market in 2026
openPR.com USA Overview This article provides an overview of a market research report on debonding-on-demand adhesives for EV battery modules. The market is expanding due to increasing pressure for battery material recovery and efficient... -
Apple Unveils 2nm iPhone 18; Samsung Cuts Thermal Resistance by 16% with Encapsulant and TIM Innovations, Intensifying Competition with TSMC
BigGo Finance South Korea Overview Following Apple's announcement of the 2nm iPhone 18, Samsung Electronics and TSMC are intensifying their competition in next-generation semiconductor packaging and thermal management. Samsung has achiev... -
Master Bond Offers Low-Stress, Low-Outgassing, Fast-Curing Glob Top Epoxy Compounds for Semiconductor Chip and Wire Bond Protection
Master Bond Inc. USA Overview Master Bond is supplying high-performance glob top epoxy compounds for the encapsulation of semiconductor chips and wire bonds in chip-on-board (COB) applications. These formulations provide effective protec... -
Master Bond Announces EP30LTE-2, a Two-Part Epoxy System Achieving Ultra-Low CTE (10-13 x 10^-6 in/in/°C) and High Dimensional Stability for Aerospace, Optical, and Electronic Industries
Master Bond Inc. USA Overview Master Bond has launched EP30LTE-2, a groundbreaking two-part epoxy system characterized by an exceptionally low coefficient of thermal expansion (CTE) of 10-13 x 10^-6 in/in/°C, coupled with outstanding dim... -
Master Bond Offers Heat-Curable and Biocompatible Epoxy Adhesive Systems Optimized for Polyimide Bonding in Semiconductor, Aerospace, and Medical Devices
Master Bond Inc. USA Overview Master Bond provides high-performance epoxy adhesive systems specifically engineered for bonding polyimide plastics to themselves and to dissimilar substrates, leveraging polyimide's superior thermal stabili... -
Master Bond Unveils Dimensionally Stable Epoxy Adhesive Systems Achieving Low Shrinkage and Ultra-Low CTE for Semiconductor and Optoelectronic Packaging
Master Bond Inc. USA Overview Master Bond has introduced dimensionally stable epoxy adhesive systems specifically engineered for semiconductor assembly, optoelectronic packaging, and high-voltage sensor potting applications. These system... -
INCURE INC. Carbon Fiber High-Temperature Resin Selection Guide Details Thermal Performance of Epoxies, Polyimides, and Post-Curing Criticality
INCURE INC. USA Overview INCURE INC. has released a selection guide for high-temperature resins used in carbon fiber composites, emphasizing that the resin matrix is the primary determinant of a laminate's heat resistance. The guide comp...
