Epoxy– tag –
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Empa and Elantas Engineer Recyclable, Flame-Retardant Epoxy Composites for Sustainable Aerospace and Rail
MaterialDistrict Switzerland Overview Researchers at Empa, in collaboration with specialty chemical company Elantas, have developed a pioneering flame-retardant and recyclable epoxy system for composite materials. This innovation, incorp... -
Master Bond Introduces Flexible Pouches and Disposable Cartridges for Epoxy Adhesives, Silicones, and UV Cure Products to Boost Productivity and Reliability
Master Bond Inc. USA Overview Master Bond has launched new packaging solutions, including flexible pouches and disposable cartridges, for its epoxy adhesives, silicones, and UV cure systems. These innovations are designed to maximize pro... -
Master Bond Launches New Epoxy Adhesives EP37-3FLF and EP5TC-80, Enhancing EV Battery Assembly Structural Integrity and Thermal Management
MasterBond.com USA Overview Master Bond has released two new epoxy products, EP37-3FLF and EP5TC-80, specifically optimized for electric vehicle (EV) battery assembly, significantly improving performance and reliability. EP37-3FLF is a h... -
Krayden Offers Low-Stress Green Epoxy Molding Compound LINQSOL EMC-7535 for High-Voltage, High-Power Semiconductors
Krayden USA Overview Krayden is offering LINQSOL EMC-7535, a green epoxy molding compound (EMC) engineered for high-voltage and high-power semiconductor devices. This material features low modulus for reduced stress, a high glass transit... -
Master Bond Introduces EP62-1LPSPMed, an Ultra-Low Viscosity Epoxy for Medical Devices with ISO 10993-5 and USP Class VI Compliance
Master Bond USA Overview Master Bond has launched EP62-1LPSPMed, an ultra-low viscosity, two-part epoxy system that has successfully passed biocompatibility testing (ISO 10993-5 and USP Class VI) for medical device applications. This mat... -
Moldex3D Compression Molding Simulation Achieves Semiconductor Package Defect Prediction and Quality Enhancement
Rheologist gaze & solutions (Moldex3D) Taiwan Overview Moldex3D provides CAE simulation tools for compression molding processes in advanced semiconductor packaging, enabling precise simulation of how encapsulating materials like epoxy mo... -
Master Bond Offers High-Strength, High-Reliability Die Attach Epoxy Adhesives for Microelectronics
Master Bond USA Overview Master Bond provides die attach epoxy adhesives for microelectronic semiconductor packaging and chip-on-board assemblies, featuring high bond strength, thermal cycling resistance, mechanical shock/vibration resis... -
Master Bond Offers Epoxy Underfill Formulations to Boost Reliability for Flip-Chip and CSP Assemblies
Master Bond USA Overview Master Bond provides epoxy underfill formulations designed to significantly enhance the long-term reliability of flip-chip and chip-scale packaging (CSP) assemblies. These materials achieve excellent adhesion to ... -
Krayden Supplies High Thermal Conductivity Hysol GR60 Series EMC for IPMs, Enhancing Reliability of Automotive and Industrial Modules with 2.2 W/mK
Krayden USA Overview Krayden offers advanced encapsulation solutions for Intelligent Power Modules (IPMs), featuring Hysol GR60 series epoxy mold compounds (EMC) with superior thermal conductivity. The GR60 HT variant achieves a thermal ... -
AI Technology Unveils Enhanced Thermal Dissipation Molding Underfill for HBM and 3D DRAM to Boost Package Reliability
AI Technology, Inc. USA Overview AI Technology, Inc. (AIT) has announced a new Molding Underfill (MUF) with significantly enhanced thermal dissipation, targeting advanced semiconductor packaging like HBM, 3D DRAM, and AI processors. This...
