Epoxy– tag –
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Multi-layer CNT Dispersion in High-Heat Epoxy and Cyanate Ester Resins Enhances Aerospace Thermal and Structural Properties
Facebook (Advanced Polymer Composites) International Overview Research indicates that dispersing multi-layer carbon nanotubes (CNTs) into high-heat epoxy and cyanate ester resins significantly improves material properties beyond just low... -
Sumitomo Bakelite Unveils Novel Low-Stress Epoxy Compound for Next-Gen 2.5D/3D Packaging
SEMI Europe Conference News Japan Overview Sumitomo Bakelite has announced a groundbreaking epoxy molding compound (EMC) at SEMI Europe, specifically engineered for the intricate demands of 2.5D and 3D advanced packaging solutions. This ... -
Fraunhofer IPA Engineers a ‘Smart’ Adhesive to Revolutionize Automotive Recycling
Fraunhofer IPA Research Highlights Germany Overview Researchers at Fraunhofer IPA have developed a groundbreaking epoxy-based debondable structural adhesive for automotive applications. This innovation allows for the clean, on-demand dis... -
Henkel Unveils Advanced EMC to Tackle Warpage and Thermal Challenges in Next-Gen AI Processors
Henkel Corporate Press Release Germany Overview Henkel has introduced a novel epoxy molding compound (EMC) engineered specifically for high-performance AI and HPC processors. This innovative material significantly reduces thermal-induced... -
3M Launches High-Impact Structural Adhesive for Automotive OEM, Bolstering Weld-Bonded and Rivet-Bonded Joints
DK Hardware USA Overview 3M has introduced its new 3M™ Impact Resistant Structural Adhesive, a two-part epoxy designed for automotive OEM applications to replace or reinforce weld-bonded and rivet-bonded joints. This silver-grey liquid a... -
Sumitomo Bakelite Hits Record ¥305 Billion Sales, Riding High on AI Silicon Encapsulant Demand
The Shashi Japan Overview Sumitomo Bakelite Co., Ltd. has announced a record-high ¥305 billion ($2.0 billion USD) in consolidated sales for FY2025, primarily propelled by a robust recovery and growth in its encapsulant materials business... -
Jinhua Leads as Top Epoxy Resin Manufacturer for Electronic Potting, Offering High Electrical Insulation, Adhesion, and Thermal Stability
jinhua China Overview Jinhua is a leading manufacturer of two-component thermosetting epoxy resin for electronic potting, widely used to encapsulate and protect sensitive electronic components from moisture, dust, chemicals, vibration, a... -
Exponential Relationship Between Underfill Adhesive Curing and Shear Strength Unveiled for Flip-Chip Micro-interconnections
springerprofessional.de Germany Overview A new study systematically investigated epoxy-based underfill adhesives in flip-chip packaging, establishing an exponential relationship between the degree of curing and shear strength. Researcher... -
3M Dominates Epoxy Structural Adhesive Patents; Multi-Material Bonding for Automotive, Aerospace Lightweighting Remains Key Opportunity
Patsnap USA Overview Patsnap's analysis reveals the epoxy structural adhesive patent landscape is mature, with 3M Innovative Properties Co leading in patent portfolios. Despite increasing demand for multi-material bonding (B32B) in autom... -
New Ultra-low Loss Build-up Dielectric Film for Advanced Packaging Reduces Signal Transmission Loss by 40%, Significantly Enhancing High-Performance IC Substrate Reliability
Vertex AI Search International Overview A novel build-up dielectric material developed for advanced integrated circuit (IC) packaging overcomes the high-frequency and high-temperature dielectric loss challenges of existing epoxy resins. ...
